Principal ASIC Package Design Engineer: FC-BGA & MCM Lead

K2 Space; Seattle (WA); Hybrid; USD 200,000 - 280,000; Full time

Benefits offered by this job

Comprehensive benefits

Job summary

K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging for high-performance mixed-signal and digital SoCs. You will drive end-to-end package strategy, engage with vendors, and define standards to ensure first-pass success for power-dense ASICs.

Join a fast-growing, Series D-funded space tech company with a hybrid in-office requirement (3 days/week) and travel to our Torrance, CA HQ.

Qualifications

• Bachelor's degree in Packaging, Mechanical, or Electrical Engineering or related field.
• 10+ years of ASIC package design experience with deep FC-BGA expertise.
• Strong understanding of substrate technologies, SI/PI fundamentals at package level, and thermal management.

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies across cost, performance, PI, SI, thermal, manufacturability, and reliability.
• Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
• Establish organizational package design standards, methodologies, and best practices.
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content.

Skills

FC-BGA

MCM

Thermal management

Si/PI simulation

OSAT coordination

Education

Bachelor's degree in Packaging Engineering / EE / ME

Tools

SIWave

HFSS

ADS

Job description

K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and MCM packaging for high-performance mixed-signal and digital SoCs. You will drive end-to-end package strategy, engage with vendors, and define standards to ensure first-pass success for power-dense ASICs.

Join a fast-growing, Series D-funded space tech company with a hybrid in-office requirement (3 days/week) and travel to our Torrance, CA HQ.