Principal ASIC Package Design Engineer

K2 Space; Los Angeles (CA); On-site; USD 200,000 - 280,000; Full time

Benefits offered by this job

Equity

Comprehensive benefits

Parental leave

401(k)

Job summary

K2 Space is seeking a Principal ASIC Package Design Engineer to lead FC-BGA and multi-chip module packaging strategies for high-performance SoCs, from early architecture through production ramp.

You will own end-to-end package architecture, drive SI/PI trade studies, power delivery, and thermal management, and engage OSATs and substrate vendors to ensure first-pass success for dense, high-speed ASICs. Collaboration with silicon and systems teams is essential.

Qualifications

• Bachelor's degree or higher in a related engineering field.
• 10+ years of ASIC package design experience, deep FC-BGA expertise.
• Strong understanding of substrate technologies, SI/PI, and thermal management.

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including stack-up and power delivery.
• Lead package-level trade studies across cost, performance, PI, SI, thermal, and reliability.
• Define long-term packaging roadmap aligned with future ASIC nodes and multi-die integration.
• Establish package design standards and best practices.
• Drive detailed FC-BGA package design for high-pin-count ASICs with high-speed SerDes and dense PDN.

Skills

ASIC package design

FC-BGA

Thermal management

SI/PI simulation

Vendor engagement

Education

Packaging Engineering

Electrical Engineering

Mechanical Engineering

Tools

SIWave

HFSS

ADS

Job description

K2 is building the largest and highest-power satellites ever flown, unlocking performance levels previously out of reach across every orbit. Backed by over $1 billion in total funding from leading investors including Altimeter Capital, ICONIQ, Kleiner Perkins, Lightspeed Venture Partners, Redpoint Ventures, and T. Rowe Price — and with over $1 billion in signed contracts across commercial and US government customers, we're mass-producing the highest-power satellite platforms ever built for missions from LEO to deep space.

The rise of heavy-lift launch vehicles is shifting the industry from an era of mass constraint to one of mass abundance, and we believe this new era demands a fundamentally different class of spacecraft. Engineered to survive the harshest radiation environments and to fully capitalize on today's and tomorrow's massive rockets, K2 satellites deliver unmatched capability at constellation scale and across multiple orbits.

With multiple launches in 2027 and plans to scale to 100 satellites a year, we're Building Bigger — helping develop the solar system and build toward a Kardashev Type II (K2) civilization. If you are a motivated individual who thrives in a fast-paced environment and you're excited about contributing to the success of a high-growth Series D-funded company, we'd love for you to apply.

The Role

We are seeking a Principal ASIC Package Design Engineer to lead advanced ASIC package architecture and execution, with a strong focus on flip-chip BGA (FC-BGA) and multi-chip module (MCM) solutions. This role owns the end-to-end package strategy for high-performance mixed-signal and digital SoCsfrom early architecture and trade studies through vendor engagement, qualification, and production ramp. You willoperateas the technical authority for package design, defining standards, influencing silicon and system architecture, and ensuring first-pass success for complex, high-speed, power-dense ASICs.

Responsibilities

• Own ASIC package architecture for FC-BGA and MCM solutions, including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints.
• Lead package-level trade studies across cost, performance, power integrity (PI), signal integrity (SI), thermal, manufacturability, and reliability.
• Define long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration.
• Establish organizational package design standards, methodologies, and best practices.
• Drive detailed design of FC-BGA packages for high-pin-count ASICs with high-speed SerDes, dense power grids, andRF signalcontent.
• Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning.
• Partner with silicon, RF, and systems teams to co-optimizedie floorplans and package interfaces.
• Own package-level SI/PI strategy, includinghigh-speed digital interfaces (e.g., SerDes, JESD, Interlaken), power delivery network (PDN) design,and decoupling strategy
• Lead thermal architecture at the package level, including lidselection, TIMs, heat-spreaders, and mechanical interfaces to system cooling.
• Manage relationships with external packaging vendors, substrate suppliers, and
• OSATs, including vendor qualification, capability assessment, contract negotiation, and performance/quality score carding to ensure roadmap and volume commitments aremet.
• Drive material selection, substrate technology choices, and assembly process optimization.

Required Qualifications

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field.
• 10+ years of experience in ASIC package design, with deepexpertisein FC-BGA.
• Strong understanding ofsubstrate technologies and materials,SI/PI fundamentals at the package level, and thermal management for power-dense ASICs.
• Fluent in SI/PI and EM simulation tools such asSIWave, HFSS, and ADS.
• Experience working directly with OSATs and substrate vendors.
• Knowledge of packaging qualification and test methodologies.

Preferred Qualifications

• Experience with MCM or heterogeneous integration (chiplets, interposers, advanced laminates).
• Background in high-speed digital or mixed-signal SoCs.
• Familiarity with aerospace, space, or high-reliability electronics.
• Experience defining packaging strategy from early architecture through first silicon and volume ramp.
• Demonstrated history of building or scaling package designmethodologywithin an organization.

Compensation and Benefits:

• Base salary range for this role is $200,000 – $280,000 + equity in the company
• Salary will be based on several factors including, but not limited to: knowledge and skills, education, and experience level
• Comprehensive benefits package including paid time off, medical/dental/vision/ coverage, life insurance, paid parental leave, and many other perks

If you don’t meet 100% of the preferred skills and experience, we encourage you to still apply! Building a spacecraft unlike any other requires a team unlike any other and non-traditional career twists and turns are encouraged!

If you need a reasonable accommodation as part of your application for employment or interviews with us, please let us know.

Export Compliance

As defined in the ITAR, “U.S. Persons” include U.S. citizens, lawful permanent residents (i.e., Green Card holders), and certain protected individuals (e.g., refugees/asylees, American Samoans). Please consult with a knowledgeable advisor if you are unsure whether you are a “U.S. Person.”

The person hired for this role will have access to information and items controlled by U.S. export control regulations, including the export control regulations outlined in the International Traffic in Arms Regulation (ITAR). The person hired for this role must therefore either be a “U.S. person” as defined by 22 C.F.R. § 120.15 or otherwise eligible for a federally issued export control license.

K2 Space is an Equal Opportunity Employer; employment with K2 Space is governed on the basis of merit, competence and qualifications and will not be influenced in any manner by race, color, religion, gender, national origin/ethnicity, veteran status, disability status, age, sexual orientation, gender identity, marital status, mental or physical disability or any other legally protected status.