Senior Embedded Packaging Architect

onsemi; Scottsdale (AZ); On-site; USD 140,000 - 190,000; Full time

Job summary

onsemi in Scottsdale, Arizona is seeking a senior engineer to lead the development and commercialization of advanced embedded packaging technologies, including embedded passives, active devices, and high-density substrate integration.

You will drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while partnering with internal and external teams throughout the product lifecycle.

Qualifications

• BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
• 8+ years of semiconductor package development experience.
• Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
• Strong knowledge of package reliability, failure analysis, and manufacturing processes.
• Experience with DOE, statistical analysis, and process optimization.
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross‑functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast‑paced environment.

Responsibilities

• Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
• Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
• Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
• Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
• Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
• Conduct root cause analysis and implement yield, quality, and cost improvements.
• Lead cross-functional teams through concept, development, qualification, and production release.

Skills

Embedded packaging

Substrate tech

Advanced interconnects

Reliability analysis

DOE statistics

Cross-functional

8D solving

ACAD

SPC

DFMEA

DOE

Education

BS or MS in Engineering

Tools

ACAD

8D

DFMEA

SPC

DOE

Job description

onsemi in Scottsdale, Arizona is seeking a senior engineer to lead the development and commercialization of advanced embedded packaging technologies, including embedded passives, active devices, and high-density substrate integration.

You will drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while partnering with internal and external teams throughout the product lifecycle.