Package Development Engineer

onsemi; Scottsdale (AZ); On-site; USD 140,000 - 190,000; Full time

Job summary

onsemi in Scottsdale, Arizona is seeking a senior engineer to lead the development and commercialization of advanced embedded packaging technologies, including embedded passives, active devices, and high-density substrate integration.

You will drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while partnering with internal and external teams throughout the product lifecycle.

Qualifications

• BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
• 8+ years of semiconductor package development experience.
• Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
• Strong knowledge of package reliability, failure analysis, and manufacturing processes.
• Experience with DOE, statistical analysis, and process optimization.
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross‑functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast‑paced environment.

Responsibilities

• Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
• Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
• Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
• Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
• Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
• Conduct root cause analysis and implement yield, quality, and cost improvements.
• Lead cross-functional teams through concept, development, qualification, and production release.

Skills

Embedded packaging

Substrate tech

Advanced interconnects

Reliability analysis

DOE statistics

Cross-functional

8D solving

ACAD

SPC

DFMEA

DOE

Education

BS or MS in Engineering

Tools

ACAD

8D

DFMEA

SPC

DOE

Job description

Job Description

Lead the development and commercialization of advanced embedded packaging technologies incorporating embedded passives, active devices, and high-density substrate integration. Drive package architecture, material selection, process development, reliability qualification, and manufacturing readiness while collaborating with internal and external partners throughout the product development lifecycle.

Responsibilities

• Develop embedded package architectures with embedded passives, active devices, and HDI substrates.
• Define substrate stack-ups, interconnect schemes, thermal solutions, and package design rules.
• Lead process development for embedding, lamination, laser drilling, metallization, and assembly.
• Drive package qualification and reliability assessments in accordance with JEDEC, IPC, and customer requirements.
• Partner with OSATs, substrate suppliers, and material vendors to establish scalable manufacturing solutions.
• Conduct root cause analysis and implement yield, quality, and cost improvements.
• Lead cross-functional teams through concept, development, qualification, and production release.

Qualifications

• BS/MS in Electrical, Mechanical, Materials, Chemical Engineering, or related field.
• 8+ years of semiconductor package development experience.
• Proven expertise in embedded packaging, substrate technologies, and advanced interconnects.
• Strong knowledge of package reliability, failure analysis, and manufacturing processes.
• Experience with DOE, statistical analysis, and process optimization.
• Experience working with OSATs, substrate suppliers, and material vendors.
• Strong communication skills, with the ability to effectively collaborate with Business Units, cross‑functional teams, internal and external manufacturing partners, and customers.
• Proficiency in engineering tools and methodologies, including ACAD, 8D, SPC, DFMEA, DOE.
• Proven ability to lead projects across organizations and cultures in a fast‑paced environment.

About Us

onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end‑markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.

More details about our company benefits can be found here: https://www.onsemi.com/careers/career-benefits

About The Team

We are committed to sourcing, attracting, and hiring high‑performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.

onsemi is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race, ethnicity, color, religion, ancestry, national origin, age, marital status, pregnancy, sex, sexual orientation, physical or mental disability, medical condition, genetic information, military or veteran status, gender identity, gender expression, or any other protected category under applicable federal, state, or local laws.

If you are an individual with a disability and require a reasonable accommodation to complete any part of the application process, or are limited in the ability or unable to access or use this online application process and need an alternative method for applying, you may contact [e-mail] for assistance.