Senior Electron Microscopy Engineer: Defect & FIB/TEM Expert

Instruct-ERIC; Texas; On-site; USD 150,000 - 210,000; Full time

Job summary

Applied Optoelectronics, Inc. (AOI) seeks a Senior Electron Microscopy Engineer to drive advanced microscopy for semiconductor laser failure analysis and yield improvement.

The candidate will lead expert analyses using FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with emphasis on defect formation and process origins. The role requires deep crystallography knowledge, hands-on FIB sample prep, and the ability to connect microscopy observations to device performance and

Qualifications

• Ph.D. required with 5+ years of industrial experience.
• Expert in advanced electron microscopy techniques (FIB, SEM, TEM/STEM, EDX/EDS, HRTEM).
• Strong knowledge of crystallography, semiconductor defects, and defect-formation mechanisms.
• Familiar with semiconductor laser materials and device fabrication processes.

Responsibilities

• Perform advanced electron microscopy analysis to identify defects, interfaces, and failure mechanisms.
• Develop advanced FIB sample-preparation methods for TEM and cross-sectional analyses.
• Analyze crystallographic and process-induced defects and determine origins.
• Correlate microscopy results with epitaxy, wafer fabrication, device performance, and yield data.
• Oversee microscopy lab operations, equipment performance, and SOPs; train staff.
• Prepare technical reports and present findings to teams and management.

Skills

Microscopy expertise

Lab leadership

Cross-functional collaboration

Education

Ph.D. in Materials Science, Physics, Electrical Engineering, or related field

Tools

FIB

SEM

EDX/EDS

TEM/STEM

HRTEM

Electron diffraction

Job description

Applied Optoelectronics, Inc. (AOI) seeks a Senior Electron Microscopy Engineer to drive advanced microscopy for semiconductor laser failure analysis and yield improvement.

The candidate will lead expert analyses using FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with emphasis on defect formation and process origins. The role requires deep crystallography knowledge, hands-on FIB sample prep, and the ability to connect microscopy observations to device performance and