Senior Electron Microscopy Engineer

AOI; Houston (TX); On-site; USD 120,000 - 170,000; Full time

Benefits offered by this job

Relocation package within US

Immigration sponsorships

Flexible health plans

401(k) matching

Generous PTO

Job summary

Applied Optoelectronics, Inc. in Houston, TX is seeking a Senior Electron Microscopy Engineer to drive failure analysis and yield improvement through advanced EM techniques. You will lead FIB/SEM/EDX/TEM work, develop cross-sectional TEM lamellae, and correlate defects with processing and device performance.

The role requires a Ph.D. with multiple years of industrial EM experience, hands-on expertise in plan-view TEM, and strong collaboration with engineering teams to enable root-cause analysis

Qualifications

• Ph.D. with 5+ years industrial experience or equivalent.
• Recognized expertise in advanced electron microscopy and plan-view lamellae.
• Strong crystallography and defect-formation knowledge.
• Experience with semiconductor laser materials and processing a plus.

Responsibilities

• Perform advanced EM analysis to identify defects, interfaces, and failure mechanisms.
• Develop site-specific cross-sectional TEM lamella and plan-view TEM prep methods.
• Analyze crystallographic defects and relate findings to formation mechanisms.
• Correlate microscopy with epitaxy, devices, and reliability data for root-cause analysis.
• Oversee lab operations, methods, SOPs, and staff training.
• Collaborate with Process Engineering, Epitaxy, Yield, Reliability, and R&D teams.
• Work with vendors/universities to advance microscopy capabilities.
• Prepare technical reports and present results and recommendations.

Skills

Advanced electron microscopy

FIB

SEM

EDX/EDS

TEM/STEM

HRTEM

Electron diffraction

Plan-view TEM specimens

Cross-sectional lamellae

Education

Ph.D. in Materials Science, Physics, Electrical Engineering, or related field

Tools

Plan-view TEM lamellae preparation

Job description

Applied Optoelectronics, Inc. (AOI) is seeking a Senior Electron Microscopy Engineer to support semiconductor laser failure analysis, process troubleshooting, and yield improvement.

The successful candidate will be a subject-matter expert in FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with strong expertise in advanced FIB sample preparation and semiconductor defect analysis. A key expectation of this position is the ability to identify structural defects, understand their formation mechanisms, and connect microscopy observations to semiconductor materials, fabrication processes, device performance, and reliability.

Job Duties

• Perform advanced electron microscopy analysis using FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction to identify defects, interfaces, compositional abnormalities, and failure mechanisms.
• Develop advanced FIB sample-preparation methods, including site-specific cross-sectional TEM lamella preparation, plan-view TEM preparation, low-damage thinning, and preparation of challenging semiconductor device structures.
• Analyze crystallographic and process-induced defects such as dislocations, stacking faults, interface defects, regrowth defects, contamination, and other microstructural abnormalities, with emphasis on understanding their formation mechanisms and process origins.
• Correlate microscopy results with epitaxy, wafer-fabrication processes, device performance, reliability testing, and yield data to support root-cause analysis and process improvement.
• Oversee microscopy laboratory operations, equipment performance, analytical methods, and sample-preparation capabilities.
• Develop and maintain SOPs and analytical procedures, and train technicians and engineers in microscopy operation, sample preparation, and data interpretation.
• Collaborate with Process Engineering, Epitaxy, Yield, Reliability, Quality, and R&D teams to investigate product failures and manufacturing issues.
• Work with equipment vendors, universities, and external laboratories to introduce advanced microscopy technologies and expand analytical capability.
• Prepare technical reports and clearly present analysis results, defect mechanisms, root-cause conclusions, and recommendations to technical teams and management.

Qualifications

• Ph.D. in Materials Science, Physics, Electrical Engineering, or a related field with 5+ years of relevant industrial experience, or equivalent industrial experience demonstrating comparable technical expertise.
• Recognized expertise in advanced electron microscopy, including FIB, SEM, EDX/EDS, TEM/STEM, HRTEM, and electron diffraction, with deep hands-on experience in advanced FIB sample preparation such as plan-view TEM specimens and site-specific cross-sectional lamellae.
• Strong knowledge of crystallography, semiconductor defects, and defect-formation mechanisms, with demonstrated ability to identify defects and determine their likely materials or process origins.
• Strong knowledge of semiconductor devices and manufacturing processes, preferably compound semiconductor lasers, including epitaxy, e-beam lithography, photolithography, wet and dry etching, PVD, CVD, metallization, and epitaxial regrowth.

Preferred Experience

Experience with InP, InGaAs, InGaAsP, DFB lasers, EMLs, quantum-well structures, buried heterostructures, and semiconductor laser failure analysis is highly desirable.

Location

WHY AOI?

In addition to competitive salary, AOI offers

• Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual and family needs
• Employer matching on 401(k) deferrals
• Generous PTO policy, with unused PTO payout at end of the year
• Relocation package available within US
• Immigration sponsorships (Must be currently authorized to work in the US)