Failure Analysis Engineer - Semiconductor Lasers (Relocation)

AOI; Sugar Land (TX); On-site; USD 85,000 - 110,000; Full time

Benefits offered by this job

Relocation package within US

Immigration sponsorships

Health, dental, vision plans

401(k) employer match

Job summary

AOI is seeking a Failure Analysis Engineer for the Process Integration team to perform failure analysis on semiconductor optical laser devices. You will leverage TEM, FIB, and HR-STEM to pinpoint defects, analyze material and electrical structures, and drive root cause investigations.

The role requires hands-on TEM/FIB experience, familiarity with EDX/EDS, XPS, and SEM techniques, and the ability to document findings in detailed technical reports for cross-functional teams.

Qualifications

• Hands-on TEM and FIB in a lab or manufacturing environment (1–3+ years).
• Master’s or Ph.D. in a relevant field preferred.
• Knowledge of compound semiconductor device theory desirable.
• Experience with DOE techniques and SPC is preferred.
• Strong data analysis and problem solving skills.
• Detail oriented and self-motivated.

Responsibilities

• Perform internal failure analysis including device decap, SEM inspection, and data analysis.
• Prepare TEM samples with FIB and perform HR-STEM imaging to identify atomic defects.
• Conduct root cause analysis of yield, reliability, or process issues.
• Characterize materials using EDX/EDS, SIMS, XPS, SEM.
• Document findings in technical reports and present to cross-functional teams.
• Maintain TEM/FIB equipment uptime through calibration and troubleshooting.

Skills

TEM

FIB

HR-STEM

EDX/EDS

SIMS

XPS

SEM

DOE techniques

SPC

LabVIEW

SQL

Microsoft Access

Python

Education

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline

Tools

TEM/FIB equipment usage

HR-STEM imaging

Job description

AOI is seeking a Failure Analysis Engineer for the Process Integration team to perform failure analysis on semiconductor optical laser devices. You will leverage TEM, FIB, and HR-STEM to pinpoint defects, analyze material and electrical structures, and drive root cause investigations.

The role requires hands-on TEM/FIB experience, familiarity with EDX/EDS, XPS, and SEM techniques, and the ability to document findings in detailed technical reports for cross-functional teams.