Failure Analysis Engineer

APPLIED OPTOELECTRONICS INC; Sugar Land, Northern (TX, KY); Hybrid; USD 90,000 - 130,000; Full time

Benefits offered by this job

Relocation package

Immigration sponsorships

401(k) matching

PTO payout

Job summary

APPLIED OPTOELECTRONICS INC in Sugar Land, TX is seeking a failure analysis engineer for the process integration team to perform internal failure analysis on semiconductor optical laser devices. The role requires hands-on TEM and FIB experience and familiarity with reliability evaluation techniques.

You will lead failure analyses, document findings in technical reports, and present data to design, process and QA teams while maintaining TEM/FIB equipment uptime. A Master’s or Ph.D.

Qualifications

• Master’s degree or Ph.D in relevant field plus 1 year of semiconductor lab or fabrication experience preferred.
• Hands-on TEM and FIB experience in lab or manufacturing.
• Knowledge of compound semiconductor device theory is desired.
• Strong data analysis and problem solving skills.
• Ability to work independently and as a team.
• Ability to work in clean room and wear PPE.
• Excellent interpersonal and communication skills.

Responsibilities

• Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.
• Hands-on experiences on sample Preparation & Imaging: Utilize FIB to prepare TEM samples and perform high-resolution imaging to identify defects at the atomic level.
• Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.
• Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.
• Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.
• Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Skills

Analytical thinking

Teamwork

Communication

Education

Master’s or PhD in a relevant field

Tools

TEM

FIB

EDX/EDS

XPS

SQL

LabVIEW

Job description

AOI is committed to providing equal opportunity in all of our employment practices, including hiring, placement, promotion, training, transfer and compensation, to all qualified applicants and employees without regard to race, color, national origin, citizenship, religion, sex, veteran status, age, disability, marital status, or any other category protected by State or U.S. Federal law. Moreover, we endeavor to treat our employees fairly.

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.

Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.

Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.

Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.

Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.

Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Qualifications

Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1–3+ years).

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.

Knowledge of compound semiconductor device theory is desired.

Microsoft Access, SQL, LabVIEW and other programing skills preferred.

Experience with DOE techniques and SPC (Statistical Process Control) is preferred.

Strong data analysis and problem solving skills.

Detail oriented and self-motivated.

Ability to work independently and as a team.

Ability to work in clean room environment wearing smock

Excellent interpersonal and communication skills for successful inter and intra-group interactions.

Physical Demands and Work Environment

Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.

The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs

Employer matching on 401(k) deferrals

Unused PTO payout at end of the year

Relocation package available within US

Immigration sponsorships (Must be currently authorized to work in the US)