Failure Analysis Engineer

AOI; Sugar Land (TX); On-site; USD 85,000 - 110,000; Full time

Benefits offered by this job

Relocation package within US

Immigration sponsorships

Health, dental, vision plans

401(k) employer match

Job summary

AOI is seeking a Failure Analysis Engineer for the Process Integration team to perform failure analysis on semiconductor optical laser devices. You will leverage TEM, FIB, and HR-STEM to pinpoint defects, analyze material and electrical structures, and drive root cause investigations.

The role requires hands-on TEM/FIB experience, familiarity with EDX/EDS, XPS, and SEM techniques, and the ability to document findings in detailed technical reports for cross-functional teams.

Qualifications

• Hands-on TEM and FIB in a lab or manufacturing environment (1–3+ years).
• Master’s or Ph.D. in a relevant field preferred.
• Knowledge of compound semiconductor device theory desirable.
• Experience with DOE techniques and SPC is preferred.
• Strong data analysis and problem solving skills.
• Detail oriented and self-motivated.

Responsibilities

• Perform internal failure analysis including device decap, SEM inspection, and data analysis.
• Prepare TEM samples with FIB and perform HR-STEM imaging to identify atomic defects.
• Conduct root cause analysis of yield, reliability, or process issues.
• Characterize materials using EDX/EDS, SIMS, XPS, SEM.
• Document findings in technical reports and present to cross-functional teams.
• Maintain TEM/FIB equipment uptime through calibration and troubleshooting.

Skills

TEM

FIB

HR-STEM

EDX/EDS

SIMS

XPS

SEM

DOE techniques

SPC

LabVIEW

SQL

Microsoft Access

Python

Education

Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline

Tools

TEM/FIB equipment usage

HR-STEM imaging

Job description

Summary

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

A failure analysis engineer for the process integration team will be responsible for failure analysis of semiconductor optical laser devices. He/She should have experience with front-end and back-end-of-line, and packaging processing. Good understanding of reliability evaluation techniques and understanding failure analysis experience is desirable. He/she will collaborate with other individuals and functional teams, define projects, address issues, develop improvement plans, and finally to document and deliver the desired end results.

Job Duties

• Responsible for internal failure analysis including device decap, internal microscopic and SEM inspection, internal measurement data analysis.


• Hands-on experiences on sample Preparation & Imaging: Utilize Focused Ion Beam (FIB) to prepare TEM samples and perform high-resolution imaging (HR-STEM) to identify defects at the atomic level.


• Root Cause Analysis: Analyze structural, electrical, and physical defects in semiconductor devices, identifying issues related to yield, reliability, or process.


• Material Characterization: Apply Energy Dispersive X-ray Spectroscopy (EDX/EDS) and other analytical techniques (SIMS, XPS, SEM) to characterize materials.


• Reporting & Collaboration: Document findings in detailed technical reports, present data to cross-functional teams (design, process, QA), and support continuous improvement initiatives.


• Equipment Maintenance: Ensure high uptime of TEM/FIB equipment through routine calibration and troubleshooting.

Qualifications

• Hands-on experience with Transmission Electron Microscopy (TEM) and FIB in a lab or manufacturing environment (typically 1–3+ years).


• Master’s degree or Ph.D in Material Science Engineering, Electrical Engineering, Physics, or related discipline plus 1 year of working experience in semiconductor laboratory or fabrication is preferred.


• Knowledge of compound semiconductor device theory is desired.


• Microsoft Access, SQL, LabVIEW and other programing skills preferred.


• Experience with DOE techniques and SPC (Statistical Process Control) is preferred.


• Strong data analysis and problem solving skills.


• Detail oriented and self-motivated.


• Ability to work independently and as a team.


• Ability to work in clean room environment wearing smock


• Excellent interpersonal and communication skills for successful inter and intra-group interactions.

Physical Demands and Work Environment

• Subject to noise, vibration, dust, odors, and exposure to toxic or caustic chemicals.


• The associate work in a manufacturing environment and be require to wear personal protective equipment.

Location

This position will be on-site based in Sugar Land, Texas.

WHY AOI?

• Flexible and competitive health (medical, dental, vision) plans offer the employee with the right options to meet individual needs


• Employer matching on 401(k) deferrals


• Unused PTO payout at end of the year


• Relocation package available within US


• Immigration sponsorships (Must be currently authorized to work in the US)