Principal TPM: Chiplet Packaging & SI/PI Leadership

Eliyan; San Francisco (CA); On-site; USD 200,000 - 260,000; Full time

Benefits offered by this job

Competitive salary

Meaningful equity

Comprehensive benefits

Job summary

Eliyan in the Bay Area is hiring a Principal Technical Program Manager to lead packaging and SI/PI programs across 2.5D/3D IC integration, interposers, and co-packaged optics.

You will own schedules, risk, and cross-team strategy, coordinating with design, package, OSAT, and vendors, and communicating progress to executives. The role demands deep technical fluency and strong leadership.

Qualifications

• Bachelor’s or Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field.
• 15+ years of experience in semiconductor program management, with substantial hands-on experience in advanced packaging (2.5D/3D) and/or SI/PI program execution.
• Deep technical fluency across SI/PI, package, and system design flows, with credibility engaging analog and digital design teams and external vendors.
• Track record of managing multiple projects with real-time visibility and sound reprioritization decisions.
• Experience managing OSAT, substrate vendor, and foundry relationships through qualification and production.
• Strong communication skills with customers and external partners, and familiarity with program dashboards.

Responsibilities

• Own and drive program schedules for advanced packaging and SI/PI workstreams from feasibility to ramp.
• Coordinate cross-functional teams across design, packaging, DFT, PCB and platform design, and external vendors.
• Manage OSAT and foundry relationships and track packaging deliverables against milestones.
• Lead program reviews and report progress to leadership with dashboards and status updates.
• Drive process improvements for packaging programs and ensure milestones stay synchronized with tapeout schedules.

Skills

Packaging

SI/PI

2.5D/3D IC

OSAT management

Vendor management

Cross-functional leadership

Jira/MS Project/Confluence

Agile/Waterfall

Education

Electrical Engineering or related field

Tools

Jira

MS Project

Confluence

Smartsheet

Job description

Eliyan in the Bay Area is hiring a Principal Technical Program Manager to lead packaging and SI/PI programs across 2.5D/3D IC integration, interposers, and co-packaged optics.

You will own schedules, risk, and cross-team strategy, coordinating with design, package, OSAT, and vendors, and communicating progress to executives. The role demands deep technical fluency and strong leadership.