Principal TPM: Chiplet Packaging & SI/PI Leadership

Eliyan Corporation; San Francisco (CA); On-site; USD 180,000 - 300,000; Full time

Benefits offered by this job

Competitive salary

Meaningful equity

Comprehensive benefits

On-site Bay Area

Job summary

Eliyan Corporation in the Bay Area is seeking a Principal Technical Program Manager to lead packaging and SI/PI programs for next‑gen chiplet platforms. You will own schedules, risks, and cross‑team strategy across packaging, interposer, and vendor programs, translating requirements between analog and digital design teams and external partners.

The role requires deep technical fluency, a record of multi‑project leadership, and the ability to drive decisions with executive stakeholders.

Qualifications

• 15+ years of semiconductor program management experience, with advanced packaging and SI/PI exposure.
• Deep fluency across SI/PI, package, and system design flows, and external vendor interaction.
• Ability to manage multiple projects with real-time status visibility and reprioritization as needed.
• Experience managing OSAT, substrate vendor, and foundry relationships through qualification and production.
• Strong problem-solving, leadership, and cross-functional decision-making skills.
• Excellent communication with both technical and non-technical stakeholders.
• Familiarity with project management tools (Jira, MS Project, Confluence, Smartsheet).

Responsibilities

• Own and drive program schedules for advanced packaging and SI/PI workstreams (2.5D/3D, interposers, bump/RDL, CPO) from feasibility to ramp.
• Engage analog/digital design teams, package engineers, and vendors to align milestones.
• Manage multiple concurrent projects with real-time status visibility and scope adjustments as needed.
• Identify bottlenecks, drive structured brainstorming, and unblock teams to keep programs on track.
• Coordinate with internal teams (design, DFT, PCB, silicon bring-up) to align milestones with ASIC/platform programs.
• Manage OSAT and foundry/vendor relationships and track packaging deliverables against timelines.
• Interface with customers/partners on co-design deliverables and integration milestones.
• Define schedules, milestones, and risk mitigation strategies; lead program reviews and status reporting.
• Oversee budgets and resource allocation for packaging programs; optimize development efforts.
• Implement process improvements and maintain dashboards/ RAID-style reporting for leadership.

Skills

Project management

Leadership

Cross-functional collaboration

Problem-solving

Experience with Jira/MS Project/Confl.

Communication skills

Education

Bachelor’s or Master’s degree in Electrical/Mechanical Engineering or Materials Science

Tools

Jira

MS Project

Confluence

Smartsheet

Job description

Eliyan Corporation in the Bay Area is seeking a Principal Technical Program Manager to lead packaging and SI/PI programs for next‑gen chiplet platforms. You will own schedules, risks, and cross‑team strategy across packaging, interposer, and vendor programs, translating requirements between analog and digital design teams and external partners.

The role requires deep technical fluency, a record of multi‑project leadership, and the ability to drive decisions with executive stakeholders.