Chiplet SI/PI Engineer: Packaging & Interconnects

Eliyan Corporation; San Francisco (CA); On-site; USD 120,000 - 150,000; Full time

Benefits offered by this job

Excellent benefits

Fun work environment

Job summary

Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.

The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits.

Qualifications

• Expertise in signal integrity and power integrity simulation methodologies.
• Experience with simulation tools such as HFSS, Q3D, Siwave, etc.
• Knowledge of using lab equipment like Vector Network Analyzer and High-Frequency Oscilloscope.

Responsibilities

• Work closely with analog circuit designers to define IO requirements.
• Conduct pre-layout and post-layout channel simulation and optimization.
• Use driver/receiver models for transient channel simulation.

Skills

Signal integrity simulation

Power integrity simulation

Simulation tools (HFSS, Q3D)

Lab equipment proficiency

Education

BS degree in EE or equivalent

MS degree in EE or equivalent

Tools

HFSS

Q3D

Siwave

PowerDC

PowerSI

ADS

Spectre

HSPICE

Allegro

Job description

Eliyan Corporation in San Francisco is seeking a Signal and Power Integrity Engineer to develop packaging solutions for chiplet interconnects. This role involves working with a cross-functional team and leading simulation efforts for advanced packaging technologies.

The ideal candidate will have a BS in EE, 5 years of experience in signal and power integrity, and be proficient with various simulation tools. Eliyan offers an exciting work environment and excellent benefits.