Director of Advanced Packaging Engineering

Thintronics®; California (MO); On-site; USD 165,000 - 240,000; Full time

Benefits offered by this job

Stock option plan

Medical, dental, vision insurance

Unlimited PTO

Paid company holidays

Job summary

Thintronics is seeking a Director / Sr Director of Engineering, Advanced Packaging to lead integration of breakthrough materials into semiconductor packaging platforms. You will report to the CTO and shape the strategy, translating materials innovation into manufacturable solutions.

The role requires deep expertise, leadership of a large engineering organization across multiple disciplines, and close collaboration with customers, fabs, and OSAT partners.

Qualifications

• Ph.D. or M.S. in a relevant engineering field with deep packaging experience.
• 12+ years in semiconductor packaging and process integration.
• Proven leadership of multidisciplinary engineering teams and direct reports.

Responsibilities

• Define and lead advanced packaging strategy and roadmaps.
• Drive DOE, process integration, and yield improvements across packages.
• Collaborate with chemistry, materials science, device engineering, and manufacturing.
• Build and mentor a world-class Advanced Packaging team.

Skills

Electrical basics

Signal integrity

Power integrity

Leadership

Cross-functional leadership

Customer facing

DFM/DRC

DOE

SPC

Package design

Education

Ph.D./M.S. in EE/Materials/Chemical Eng/Physics

Tools

ECAD

Reliability testing equipment

Job description

Thintronics is seeking a Director / Sr Director of Engineering, Advanced Packaging to lead integration of breakthrough materials into semiconductor packaging platforms. You will report to the CTO and shape the strategy, translating materials innovation into manufacturable solutions.

The role requires deep expertise, leadership of a large engineering organization across multiple disciplines, and close collaboration with customers, fabs, and OSAT partners.