Director of MEMS Packaging Innovation & Strategy

Sitime-Corporation; Santa Clara (CA); On-site; USD 239,000 - 342,000; Full time

Benefits offered by this job

Equity grants

401k plan

Health and wellness

Job summary

SiTime seeks a seasoned packaging leader to drive its packaging roadmap, creating thermally and mechanically stable environments for co-packaged MEMS. You will lead cross-functional teams, partner with OSAT suppliers, and guide material selection from substrates to mold compounds, ensuring performance and reliability.

The ideal candidate has 10+ years in semiconductor packaging R&D, with 5+ years leading geographically distributed teams, and strong collaboration with OSATs and foundries.

Qualifications

• 10+ years of semiconductor packaging R&D experience.
• At least 5 years leading teams focused on advanced heterogeneous integration.
• Expertise in semiconductor materials, process integration, process engineering and metrology.
• Experience collaborating with OSATs and foundries.
• Global teams management experience.

Responsibilities

• Packaging Roadmap & Architecture: Define the packaging roadmap that enables performance, form-factor, reliability and cost.
• OSAT Development Collaboration: Lead relationships with OSAT partners and manage local teams; accelerate development velocity and transfer to production.
• Mechanical Design: Oversee design, analysis and characterization for fit, thermal performance, structural stability, die stress, vibration immunity, and manufacturability.
• Electrical Interface Optimization: Collaborate with IC design teams to optimize parasitic capacitance, resistance, and signal integrity.
• Advanced Material Characterization: Drive selection and qualification of substrates, die-attach materials, underfills, and mold compounds.
• Packaging Laboratory: Drive workflows to accelerate screening of alternative materials and characterization of package performance and reliability.
• Productivity: Define best practices and manage KPI metrics for all aspects of package development process and package lifecycle.
• Team Leadership: Track record of talent and leadership development of engineers and technicians to create high-performance, execution-focused teams.

Skills

Semiconductor packaging

R&D leadership

Global teams

Materials science

Education

Ph.D. or Master's in Mechanical Engineering, Materials Science, Microelectronics, or Physics

Tools

EDA tool chains

Job description

SiTime seeks a seasoned packaging leader to drive its packaging roadmap, creating thermally and mechanically stable environments for co-packaged MEMS. You will lead cross-functional teams, partner with OSAT suppliers, and guide material selection from substrates to mold compounds, ensuring performance and reliability.

The ideal candidate has 10+ years in semiconductor packaging R&D, with 5+ years leading geographically distributed teams, and strong collaboration with OSATs and foundries.