Director of Chiplet & FCBGA Integration

MIcro-Precision Technologies; Tempe (AZ); Hybrid; USD 180,000 - 240,000; Full time

Job summary

Amkor Technology is seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The role centers on program management for development of advanced chiplet-based IC packages, including HDFO, with the primary interface to Tier 1 customers and Amkor's R&D center in Korea.

You will lead a cross-functional team across R&D, design, characterization and simulation, manage product development through to initial production ramp, and drive customer meetings to ensure on-time delivery and robust

Qualifications

• Bachelor's in Engineering, Mechanical or Materials preferred; Master's a plus.
• 10+ years in semiconductor package development, with IC Packaging experience.
• Understanding of IC package design environment and tradeoffs during FCBGA development.
• Knowledge of mechanical stress/strain and IC package warpage.
• Knowledge of packaging materials, failure modes and reliability qualification.
• Excellent written and verbal communication skills.
• Willingness to travel 10-20% domestically and internationally.

Responsibilities

• Drive and coordinate development activities with customers, in conjunction with R&D teams in Korea.
• Lead Tier 1 customer interface meetings during the project development phase.
• Manage a cross-functional team with R&D, Design, Characterization and Simulation as required.
• Manage customer product management through development and into initial production ramp.

Skills

Project management

IC packaging expertise

Mechanical stress/strain

Reliability qualification

Leadership

Communication skills

Education

Bachelor's degree in Engineering

Master's degree preferred

Tools

DOE

SPC

Job description

Amkor Technology is seeking a Director, Chiplets and FCBGA for our Tempe, AZ office. The role centers on program management for development of advanced chiplet-based IC packages, including HDFO, with the primary interface to Tier 1 customers and Amkor's R&D center in Korea.

You will lead a cross-functional team across R&D, design, characterization and simulation, manage product development through to initial production ramp, and drive customer meetings to ensure on-time delivery and robust