Senior CMP/Bond Equipment Development Leader

Micron Technology, Inc.

Boise (ID)

On-site

USD 120,000 - 150,000

Full time

14 days+

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Benefits offered by this job

Medical plans

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Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology, Inc. is seeking a Sr. Engineer for CMP/Bond Equipment Development in Idaho. The role involves installing, starting up and continuously improving advanced semiconductor processing equipment.

You will work with process engineering and external vendors to push next-gen memory performance. You will mentor engineers, lead large technical projects, and standardize methods across FABs. A Bachelor's degree and 2 years of related experience are required; strong analytical skills and

Qualifications

Semiconductor process or equipment engineering experience.
CMP/Bond equipment development with understanding of CMP and Grind interactions.
DOE, defect analysis and data analysis techniques.
Analytical skills and problem-solving using model-based methods.
Statistical methods including SPACE and E3 software.

Responsibilities

Install, start-up and improve CMP/Bond equipment and hardware across fab and with vendors.
Lead module-level development and manage large technical projects.
Standardize methods and procedures across areas and facilities.
Analyze results, interpret data and implement improvements to yield, scrap, rework or cycle time.
Mentor junior engineers and communicate complex information to customers.