Senior CMP/Bond Equipment Engineer: Lead Module Development

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 130,000; Full time

Benefits offered by this job

Medical plans

Paid time off

Paid holidays

Paid family leave

Job summary

Micron Technology, Inc. is seeking a skilled Equipment Engineer to install, start up, and continuously improve advanced semiconductor processing equipment in Boise, ID.

You will work with process engineering and vendors to enable leadership in next-gen memory and drive module-level development on large technical projects. The role requires a Bachelor's in engineering/related field and 2 years of experience in CMP/Bond processes, experimental design (DOE), data analysis, and problem solving.

Qualifications

• Bachelor's degree in Engineering Technology or related field with 2 years of experience.
• Semiconductor process or equipment engineering experience.
• CMP/Bond equipment development with CMP/grind understanding.

Responsibilities

• Install and startup semiconductor processing equipment and improve performance.
• Lead module level development and large technical projects.
• Standardize methods and procedures across FABs and shifts.
• Analyze results and implement process or equipment changes to improve yield and scrap.

Skills

Analytical skills

DOE

Data analysis

Problem solving

Statistical methods

Education

Bachelor's degree in Engineering Technology or related field

Tools

JMP Pro 18

SPACE

E3 software

EMA

Job description

Micron Technology, Inc. is seeking a skilled Equipment Engineer to install, start up, and continuously improve advanced semiconductor processing equipment in Boise, ID.

You will work with process engineering and vendors to enable leadership in next-gen memory and drive module-level development on large technical projects. The role requires a Bachelor's in engineering/related field and 2 years of experience in CMP/Bond processes, experimental design (DOE), data analysis, and problem solving.