Senior Cloud Hardware Packaging Engineer - Optics Networking

Amazon; Cupertino (CA); On-site; USD 183,000 - 248,000; Full time

Job summary

Amazon AWS seeks a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team.

You will design, develop, validate, and sustain IC and SOC packages for high‑speed applications, collaborating with design teams, manufacturers, and cross‑functional partners to deliver robust packaging solutions at scale. Based in Cupertino, CA, you will help enable the backbone of the AWS network interconnect, drive quality, reliability, and cost‑effective

Qualifications

• Bachelor's degree or higher in mechanical, electrical, materials science, or physics.
• 8+ years in IC/SOC packaging design, development, or validation.
• 8+ years experience with high-speed signal integrity and package modeling.
• 2+ years working with IC/SOC packaging suppliers and related manufacturers.
• 1+ years automation scripting with Python, Bash, Shell or Matlab.

Responsibilities

• Collaborate with vendors to evaluate packaging technologies and create implementation plans.
• Develop and automate test plans for package characterization (signal integrity, power integrity, thermal, mechanical).
• Define and develop test plans for IC/SOC packages, substrates, and interconnects.
• Work with operations to identify quality issues, improve yields, and optimize RMA processes.

Skills

IC/SOC packaging

Signal integrity

Electrical modeling

Supplier collaboration

Automation scripting

Education

Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics

Ph.D. in mechanical engineering, electrical engineering, materials science, physics or equivalent

Job description

Amazon AWS seeks a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team.

You will design, develop, validate, and sustain IC and SOC packages for high‑speed applications, collaborating with design teams, manufacturers, and cross‑functional partners to deliver robust packaging solutions at scale. Based in Cupertino, CA, you will help enable the backbone of the AWS network interconnect, drive quality, reliability, and cost‑effective