Senior Cloud Hardware Packaging Engineer (IC/SOC)

Amazon; Cupertino (CA); On-site; USD 183,000 - 248,000; Full time

Benefits offered by this job

RSUs

Health insurance

401(k) matching

Job summary

Amazon is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team in Cupertino.

You will enable IC/SOC packages for high-speed network interconnect, collaborating with design teams, manufacturing partners and cross-functional stakeholders to deliver robust solutions at scale. This role emphasizes design, validation, and sustaining engineering of packages, with opportunities to influence both hardware and software tools to

Qualifications

• Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics.
• 8+ years of work experience on IC/SOC packaging design, development, or validation.
• 8+ years of experience with high-speed signal integrity principles, transmission line theory, and package electrical modeling.
• 2+ years of experience working with IC/SOC packaging suppliers, substrate manufacturers, assembly houses, and qualification processes.
• 1+ years of automation scripting using Python, Bash, Shell and/or Matlab

Responsibilities

• Collaborate with vendors/manufacturers to evaluate new packaging technologies and development plans for product roadmaps.
• Develop and automate test plans for package characterization including signal integrity, power integrity, thermal performance, and mechanical reliability.
• Collaborate with vendors/manufacturers in defining and developing test plans for IC/SOC packages, substrates, and interconnect technologies.
• Work with operations teams in identifying quality issues, improving manufacturing yields, and optimizing RMA processes for packaged components.

Skills

IC/SOC packaging

High-speed signal integrity

Automation scripting (Python, Bash, &/

Supplier coordination

Test planning

Education

Bachelor's degree or above in mechanical engineering, electrical engineering, materials science, or physics

Tools

Python

Bash

Shell

MATLAB

Job description

Amazon is seeking a Sr. Cloud Hardware Development Engineer (CHDE) with packaging expertise to join the Network Product Development team in Cupertino.

You will enable IC/SOC packages for high-speed network interconnect, collaborating with design teams, manufacturing partners and cross-functional stakeholders to deliver robust solutions at scale. This role emphasizes design, validation, and sustaining engineering of packages, with opportunities to influence both hardware and software tools to