Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI; Town of Poland (NY); Hybrid; USD 120,000 - 150,000; Full time

Benefits offered by this job

Attractive compensation package

Pension plan

Employee insurances

Job summary

Axelera AI is looking for a Senior Advanced Packaging & Power Delivery Engineer to shape silicon architecture for AI accelerators. This role demands ownership of power-delivery design and collaboration across teams to influence product delivery.

The ideal candidate has over 7 years of experience, a degree in Electrical Engineering, and proficiency in advanced packaging technologies. Flexible work arrangements are offered, alongside an attractive compensation package.

Qualifications

• 7+ years of experience in power delivery and/or advanced packaging design.
• Demonstrated expertise in on-die power grid design.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies.

Responsibilities

• Own power-delivery design end to end.
• Lead advanced packaging architecture decisions.
• Perform SI/PI verification and sign-off.

Skills

Power delivery design

Advanced packaging design

2.5D/3D packaging technologies

Cross-functional communication

Education

Bachelor’s or Master’s degree in Electrical Engineering

Tools

EDA tools for power integrity

Job description

Axelera AI is looking for a Senior Advanced Packaging & Power Delivery Engineer to shape silicon architecture for AI accelerators. This role demands ownership of power-delivery design and collaboration across teams to influence product delivery.

The ideal candidate has over 7 years of experience, a degree in Electrical Engineering, and proficiency in advanced packaging technologies. Flexible work arrangements are offered, alongside an attractive compensation package.