Senior Advanced Packaging & PDN Architect (2.5D/3D)

Axelera AI; Indiana (PA); Hybrid; USD 110,000 - 140,000; Full time

Benefits offered by this job

Attractive compensation package

Pension plan

Employee insurances

Company shares option

Job summary

Axelera AI in Indiana is looking for a Senior Advanced Packaging & Power Delivery Engineer to lead the design of power delivery solutions for next-generation AI accelerators. You will be involved in architecture decisions concerning 2.5D and 3D integration and will collaborate closely with the R&D team.

The ideal candidate has at least 7 years of experience in the semiconductor industry, possesses a relevant degree, and is skilled in using industry-standard EDA tools.

Qualifications

• 7+ years of experience in power delivery or advanced packaging design.
• Demonstrated expertise in on-die power grid design.
• Hands-on experience with 2.5D and/or 3D IC packaging technologies.

Responsibilities

• Own power-delivery design end to end.
• Lead advanced packaging architecture decisions.
• Perform SI/PI verification and sign-off.

Skills

Power delivery design

Advanced packaging technologies

Cross-functional collaboration

On-die power grid design

EDA tools for PDN simulation

Education

Bachelor's or Master's degree in Electrical Engineering

Tools

EDA tools

Job description

Axelera AI in Indiana is looking for a Senior Advanced Packaging & Power Delivery Engineer to lead the design of power delivery solutions for next-generation AI accelerators. You will be involved in architecture decisions concerning 2.5D and 3D integration and will collaborate closely with the R&D team.

The ideal candidate has at least 7 years of experience in the semiconductor industry, possesses a relevant degree, and is skilled in using industry-standard EDA tools.