Senior Technologist - Advanced Packaging & NPI

Dormont Manufacturing Co; Boise (ID); On-site; USD 120,000 - 150,000; Full time

Job summary

Dormont Manufacturing Co seeks a qualified individual to lead advanced packaging technology efforts. The ideal candidate will have over 15 years of experience in the semiconductor industry, especially in module process development.

This role involves driving improvements, managing projects, and building cross-functional relationships. Strong leadership and communication skills are essential to ensure a positive customer experience.

Join us to be part of the tech that enables devices improving lives globally.

Qualifications

• 15+ years of experience in the semiconductor field, especially in Thin Film/PECVD/LPCVD/ALD module process development.
• Strong project management and analytical skills.
• Effective English oral and written communication skills.

Responsibilities

• Lead advanced packaging technology engagement for customer new products.
• Drive module process and equipment improvements to meet customer needs.
• Build strong relationships with Product Marketing, Product Development, and Service Engineering.

Skills

Project management

Analytical skills

Effective communication

Leadership

Collaboration

Education

Bachelor's in Materials Science, Electrical Engineering, Chemical Engineering, Physics

Job description

Dormont Manufacturing Co seeks a qualified individual to lead advanced packaging technology efforts. The ideal candidate will have over 15 years of experience in the semiconductor industry, especially in module process development.

This role involves driving improvements, managing projects, and building cross-functional relationships. Strong leadership and communication skills are essential to ensure a positive customer experience.

Join us to be part of the tech that enables devices improving lives globally.