Sr Staff Advanced Package Design Engineer - 19001

Synopsys Inc; Sunnyvale (CA); On-site; USD 180,000 - 240,000; Full time

Job summary

Synopsys Inc. seeks an experienced hardware packaging engineer to advance SIPI-centric silicon package designs.

You will work with cross-functional teams to optimize signal integrity and power integrity while delivering cutting-edge interposers and fanout packages. The role requires a decade of hands-on packaging experience, strong circuit theory, and proficiency with Cadence, Synopsys tools, and OSAT technologies.

Qualifications

• Bachelor’s degree in Electrical or Electronic Engineering is required; Master’s or PhD preferred.
• Minimum 10 years in advanced package design, model extraction, and analysis.
• Deep knowledge of advanced circuit and transmission line theory.
• Hands-on experience with leading semiconductor nodes and OSAT tech.

Responsibilities

• Collaborate with cross-functional teams to define SIPI performance requirements and power integrity.
• Design and develop advanced silicon package solutions (e.g., silicon interposers, RDL fanout, bridge packages).
• Model and analyze package designs for electrical, thermal, and mechanical performance.
• Present as technical leader on business unit projects and mentor peers.

Skills

Advanced packaging

Multi-physics analysis

Electrical engineering insight

Problem solving

Education

Bachelor's degree in Electrical or Electronic Engineering

Master’s or PhD preferred

Tools

Cadence APD

Innovus

Integrity-3DIC

Synopsys ICC2

3DIC Compiler

Fusion Compiler

Job description

We Are:

At Synopsys, we drive the innovations that shape the way we live and connect. Our technology is central to the Era of Pervasive Intelligence, from self-driving cars to learning machines. We lead in chip design, verification, and IP integration, empowering the creation of high-performance silicon chips and software content. Join us to transform the future through continuous technological innovation.

You Are:

You are a seasoned hardware engineering professional with a passion for advanced silicon package design and a proven track record in delivering innovative solutions for complex semiconductor challenges. With more than a decade of hands‑on experience in package and interposer design, you possess a deep understanding of the latest advancements in 3DIC and multi-physics analysis. Your expertise spans across multiple advanced packaging technologies, and you are enthusiastic about pushing the boundaries of what’s possible in high-performance, energy‑efficient chip design.

You thrive in a collaborative and fast‑paced environment, working seamlessly with multidisciplinary teams and customers to solve technical challenges creatively and efficiently. Your strong analytical skills, coupled with your ability to communicate complex technical concepts clearly, make you a trusted advisor and mentor within your team. You are comfortable working with industry‑leading EDA tools and have a solid foundation in both Windows and Linux environments.

Your commitment to continuous learning and innovation drives you to stay updated with emerging trends and technologies. You approach every project with a can‑do attitude and demonstrate adaptability, resilience, and a relentless pursuit of excellence. You are excited by the opportunity to make a significant impact at Synopsys, contributing to groundbreaking products that shape the future of technology.

What You’ll Be Doing:

• Collaborating with cross‑functional teams during early design stages to optimize and define SIPI (Signal Integrity/Power Integrity) performance requirements, including bump mapping and power estimation.
• Designing and developing advanced silicon package solutions such as silicon interposers, RDL fanout packages, and silicon bridge packages.
• Modeling and analyzing advanced package designs to ensure optimal electrical, thermal, and mechanical performance.
• Representing Synopsys on business unit projects as a technical leader and subject matter expert in advanced packaging.
• Resolving a wide range of design and integration issues using creative, data‑driven approaches.
• Supporting customer engagements in exploring and implementing advanced package solutions with Synopsys IPs.
• Collaborating with global teams to share best practices and drive innovation in advanced packaging methodologies.

The Impact You Will Have:

• Empowering Synopsys and its customers to deliver next‑generation, high‑performance silicon solutions.
• Accelerating the adoption of advanced packaging technologies that enable new levels of integration and energy efficiency.
• Enhancing the performance, reliability, and manufacturability of Synopsys IP test chip packages.
• Driving technical excellence and innovation in business unit projects that define Synopsys’ leadership in the semiconductor industry.
• Mentoring and guiding engineering peers, fostering a culture of knowledge sharing and continuous improvement.
• Setting new industry standards for quality, performance, and innovation in advanced package design.
• Building and strengthening customer relationships through expert support and collaboration.

What You’ll Need:

• Bachelor’s degree in Electrical or Electronic Engineering (Master’s or PhD preferred).
• Minimum of 10 years’ relevant experience in advanced package design, model extraction, and analysis.
• Expert knowledge of advanced circuit and transmission line theory.
• Hands‑on experience with TSMC, Intel, Samsung, or OSAT advanced package technologies.
• Proficiency in multi‑physics analysis (EMIR, Thermal, Thermal‑Mechanical, Electromagnetic, etc.).
• Familiarity with both Windows and Linux operating systems.
• Experience with industry‑standard EDA tools such as Cadence APD, Innovus, Integrity‑3DIC, Synopsys ICC2, 3DIC Compiler, and Fusion Compiler.

Who You Are:

• A creative problem solver with strong analytical and critical thinking skills.
• An excellent communicator, able to explain technical concepts to diverse audiences.
• A collaborative team player who values inclusivity, diversity, and shared success.
• Adaptable, quick to learn, and enthusiastic about adopting new technologies and methodologies.
• Detail‑oriented, quality‑driven, and committed to continuous improvement and innovation.
• Self‑motivated with a strong sense of ownership and accountability.

The Team You’ll Be A Part Of:

Join a global, highly skilled, and supportive team dedicated to advancing the forefront of package design and integration. Our team works closely with R&D, product management, and customer engineering groups to foster innovation, technical excellence, and open communication. Together, we tackle some of the most complex challenges in the semiconductor industry, supporting each other’s growth and celebrating our collective achievements.

Rewards and Benefits:

We offer a comprehensive range of health, wellness, and financial benefits to cater to your needs. Our total rewards include both monetary and non‑monetary offerings. Your recruiter will provide more details about the salary range and benefits during the hiring process.