3DHI Packaging Engineer – Hardware Protection

Lockheed Martin; Orlando (FL); On-site; USD 105,000 - 195,000; Full time

Benefits offered by this job

Medical

Dental

Vision

401(k) match

Paid time off

Holidays

Parental Leave

EAP

Flexible Spending Accounts

Education Assistance

Job summary

Lockheed MartinMissiles and Fire Control (MFC) seeks a Staff Electromechanical Design Engineer to lead hardware for 3DHI packaging. You will drive technical strategy, own critical designs, and mentor engineers across IPTs while ensuring reliability in harsh environments.

Responsibilities include overseeing heat transfer, structural integrity, FEA-based simulations, packaging qualification, and risk management. Travel may be required for program meetings and reviews.

Qualifications

• Bachelor of Science in Electrical or Mechanical Engineering or closely related STEM field; Master’s/PhD preferred or 15+ years of experience without a degree.
• 3D Heterogeneous Integration (3DHI) experience.
• Advanced Packaging experience.
• Technical or project leadership in high-reliability electronics.

Responsibilities

• Owns package hardware design including substrates, heat spreaders, stiffeners, and thermal management for 3DHI packages.
• Lead FEM/Multiphysics analyses for thermal, power integrity, and mechanical stress.
• Define and execute package qualification plans to JEDEC/MIL-SPEC standards.
• Mentor engineers and coordinate cross-functional teams to deliver hardware on schedule.

Skills

3DHI

Advanced Packaging

Technical leadership

Electromechanical design

Microelectronics design

CREO modeling

Earned value management

Cross-functional collaboration

Education

B.S. in Electrical or Mechanical Engineering

Master’s degree or PhD preferred

15+ years of experience

Tools

FEA

CREO

Job description

Lockheed MartinMissiles and Fire Control (MFC) seeks a Staff Electromechanical Design Engineer to lead hardware for 3DHI packaging. You will drive technical strategy, own critical designs, and mentor engineers across IPTs while ensuring reliability in harsh environments.

Responsibilities include overseeing heat transfer, structural integrity, FEA-based simulations, packaging qualification, and risk management. Travel may be required for program meetings and reviews.