Wafer Process Integration Engineer

Socket.dev; Milpitas (CA); On-site; USD 130,000 - 178,000; Full time

Job summary

TDK/Headway Technologies, Inc. in Milpitas, CA is seeking an Integration Engineer to lead wafer-level process integration and characterization for next-generation technology programs. The role focuses on experimentation, failure analysis, and data-driven improvements.

Requirements include a BS in engineering or physics and 3+ years in semiconductor process integration or characterization; JMP experience is a plus. Eligible for standard benefits with a competitive base salary.

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, or Physics; Master’s or PhD preferred.
• Three years of hands-on experience in process integration or characterization in a semiconductor environment.
• Hands-on experience using JMP or similar analytical application.
• Proficient in Microsoft Office applications.

Responsibilities

• Develops and delivers process integration and characterization techniques for new technology programs and next generation products.
• Designs and conducts experiments to verify process robustness; analyzes data and performs FMEA to meet product requirements.
• Performs wafer level process characterization on thin film recording heads using FIB and CD-SEM; identifies defects and provides corrective actions.
• Reviews backend performance data and makes recommendations to improve performance.
• Communicates findings to teams and management; adheres to safety policies.

Skills

Process integration

Characterization

Data analysis

Root cause analysis

Communication

Time management

Education

Bachelor’s degree in Electrical Engineering, Materials Science, or Physics

Master’s or PhD preferred

Tools

JMP

MS Visual Basic

FIB tool

CD-SEM

Job description

TDK/Headway Technologies, Inc. in Milpitas, CA is seeking an Integration Engineer to lead wafer-level process integration and characterization for next-generation technology programs. The role focuses on experimentation, failure analysis, and data-driven improvements.

Requirements include a BS in engineering or physics and 3+ years in semiconductor process integration or characterization; JMP experience is a plus. Eligible for standard benefits with a competitive base salary.