Senior 300mm Wafer Packaging Engineer

Arizona State University; Tempe (AZ); On-site; USD 115,000 - 155,000; Full time

Benefits offered by this job

Health insurance

Tuition reduction

Retirement plans

Job summary

Arizona State University is seeking a Senior Process Engineer for the Advanced Electronics and Packaging Core Facility in Tempe. The role focuses on wafer prep and finishing, including die attach, molding, grinding, wafer saw, and ball drop/reflow, with development on 300mm tooling and ownership of dicing saw and wafer grinders.

Working with device physics, deposition, etching, photolithography, and electrical test, you will ensure robust packaging processes, improve yields, and support

Qualifications

• Bachelor's degree and five (5) years of experience or equivalent combination.
• Master’s degree with seven (7) years of engineering experience preferred.

Responsibilities

• Maintain wafer prep and finishing by supporting operations, increasing equipment uptime, responding to production issues, and reducing costs.
• Assist students, faculty, and other professionals with service requests.
• Write procedures to help students and other users safely use the equipment.
• Provide supervision and guidance to the users of the Core.

Skills

Interpersonal communication

Statistical data analysis

Problem-solving

Education

Bachelor's degree

Master’s degree in engineering

Tools

Dicing saw

Wafer grinders

Molding equipment

Job description

Arizona State University is seeking a Senior Process Engineer for the Advanced Electronics and Packaging Core Facility in Tempe. The role focuses on wafer prep and finishing, including die attach, molding, grinding, wafer saw, and ball drop/reflow, with development on 300mm tooling and ownership of dicing saw and wafer grinders.

Working with device physics, deposition, etching, photolithography, and electrical test, you will ensure robust packaging processes, improve yields, and support