Senior Director, Advanced Packaging & Wafer Services

Semiconductor Engineering; Tempe (AZ); Hybrid; USD 250,000 - 320,000; Full time

Job summary

Amkor in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures.

The role requires strategic customer engagement with Tier 1 clients, collaboration with global R&D centers, and steering programs from development to production ramp while guiding architecture, process integration, and reliability.

Qualifications

• Bachelor’s degree in Engineering required; advanced degree preferred.
• 10+ years in semiconductor package development or wafer tech.
• Experience leading customer engagements with major customers.
• Strong understanding of IC package architecture and wafer process integration.
• Willingness to travel 10–20% domestically and internationally.

Responsibilities

• Lead strategic engagements with Tier 1 customers and align roadmaps.
• Coordinate development with global R&D teams for timely execution.
• Serve as senior interface for customer meetings and reviews.
• Lead cross-functional teams across R&D, design, characterization, and operations.
• Own product management from concept to initial production ramp.
• Guide tradeoffs on package architecture, materials, and yield risk.
• Engage ecosystem partners and wafer suppliers to influence roadmap direction.

Skills

Semiconductor packaging

Wafer-level packaging

Customer engagement

Cross-functional leadership

Project management

Education

Bachelor’s degree in Engineering

Master’s degree or Ph.D. preferred

Job description

Amkor in Tempe, AZ is seeking a senior Director of Advanced Packaging and Wafer Services to lead development and commercialization of advanced wafer-based IC package platforms, including HDFO, 2.5D, and chiplet architectures.

The role requires strategic customer engagement with Tier 1 clients, collaboration with global R&D centers, and steering programs from development to production ramp while guiding architecture, process integration, and reliability.