Senior Substrate Process Engineer — Equity Opportunities

Syenta

Tempe (AZ)

On-site

USD 120,000 - 190,000

Full time

11 days ago
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Benefits offered by this job

Equity opportunities
401(k) and benefits
Health, dental, and vision coverage
Professional growth
Team events
Work-life balance
15 days PTO and 10 days sick leave

Job summary

Syenta in Tempe, AZ is seeking a Senior Process Engineer (Substrate) to advance our LEM tooling for advanced packaging. You will develop PID coating and patterning for fine-line circuitry and drive wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification.

You will collaborate across substrate build-up, microfabrication, and characterization, translating prototypes into scalable manufacturing solutions while working with

Qualifications

  • Bachelor's degree in a related field and 7+ years microfabrication experience.
  • Hands-on PID materials knowledge and interposer buildup advantageous.
  • Experience with photolithography, etching, deposition, and metrology.

Responsibilities

  • Develop and optimize PID and light-sensitive insulating material processes for advanced packaging.
  • Drive multi-layer build-up process development and translate prototypes into scalable manufacturing.
  • Execute microfabrication steps including photolithography, etching, deposition, wet processing, and metrology verification.
  • Troubleshoot defects and collaborate across teams to deliver prototypes and production-ready processes.

Skills

Microfabrication
Cleanroom proficiency
Cross-functional collaboration

Education

Bachelor's in Physics/Materials Science/Engineering
Master's or PhD preferred

Tools

Photoresist coating tools
Exposure systems
Etching (ICP/RIE/CCP)
Thin-film deposition (PECVD/PVD)
Metrology & inspection tools

Job description

Syenta in Tempe, AZ is seeking a Senior Process Engineer (Substrate) to advance our LEM tooling for advanced packaging. You will develop PID coating and patterning for fine-line circuitry and drive wafer-level processing including photolithography, etching, thin-film deposition, wet processing, and metrology verification.

You will collaborate across substrate build-up, microfabrication, and characterization, translating prototypes into scalable manufacturing solutions while working with

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