RF Test Engineer – Automated Wafer & Production Test

Tektronix, Inc.; Beaverton (OR); Vor Ort; USD 83.000 - 155.000; Vollzeit

Zusammenfassung

Tektronix Component Solutions in Beaverton, Oregon is seeking an experienced RF Test Engineer to join our New Product Development team. You will develop custom hardware and software test solutions for high-performance RF, microwave, precision analog, mixed-signal, and digital devices and components.

This hands-on role focuses on calibration, fixture design, test automation, and correlation for wafer-sort and packaged-device production with collaboration across product engineering, manufacturing,

Qualifikationen

• Bachelor's degree in Electrical Engineering or closely related field; 5+ years of relevant experience.
• Experience developing test/characterization solutions for RF or microwave devices, ASICs or packaged components.
• Hands-on proficiency with RF measuring instruments (VNAs, spectrum analyzers) and RF switching systems.

Aufgaben

• Develop, qualify, document, and release automated RF/microwave test solutions for wafer-sort and packaged-device production.
• Translate device specs into practical test methods, hardware architectures, and software routines.
• Create maintainable test automation software and data workflows for instrument control and data analysis.
• Collaborate with engineering, manufacturing, and quality teams to transfer tests into production.

Kenntnisse

RF test

Test automation

Python/C++/LabVIEW

Signal integrity

Ausbildung

Bachelor's degree in Electrical Engineering

Tools

VNAs

Spectrum Analyzers

Oscilloscopes

Jobbeschreibung

Tektronix Component Solutions in Beaverton, Oregon is seeking an experienced RF Test Engineer to join our New Product Development team. You will develop custom hardware and software test solutions for high-performance RF, microwave, precision analog, mixed-signal, and digital devices and components.

This hands-on role focuses on calibration, fixture design, test automation, and correlation for wafer-sort and packaged-device production with collaboration across product engineering, manufacturing,