RF Chiplet Design Engineer - Heterogeneous Integration

Imec; Kissimmee (FL); Presencial; USD 120.000 - 180.000; Jornada completa

Descripción de la vacante

imec USA’s Kissimmee, Florida R&D Center is advancing RF heterogeneous integration technologies for ultra-high-frequency applications. You will co-design and simulate CMOS and III-V devices on silicon interposers, balancing performance with manufacturability.

You will work with a multidisciplinary team across the US and Belgium, developing building blocks, performing tapeouts, and contributing to technical publications and prototypes for real-world applications.

Formación

• PhD or Master’s degree in electrical engineering or a related field with 3+ years of relevant experience.
• Proficiency with Cadence Virtuoso for CMOS chiplet design and tapeout.
• Experience using Keysight ADS and Ansys HFSS for RF/electromagnetic simulations.

Responsabilidades

• Design RF building blocks such as phase shifters, frequency multipliers, power amplifiers, and PLLs for heterogeneous integration.
• Use electromagnetic simulation to extract parasitics and inform co-design.
• Design and tape out advanced CMOS circuits using Cadence Virtuoso and related tools.
• Design and tape out III-V circuits using RF design tools (Keysight ADS) and HFSS simulations.
• Co-design interconnects between active chiplets and RF interposers.
• Evaluate tradeoffs among RF performance, signal integrity, packaging, and manufacturability.
• Participate in design reviews and produce technical documentation and reports.
• Collaborate with imec teams in the US and Belgium and with external customers/partners.

Conocimientos

Strong written & verbal communication

Multidisciplinary teamwork

Self-driven

Educación

PhD or Master’s in Electrical Engineering or related field

3+ years of relevant experience

Herramientas

Cadence Virtuoso

Keysight ADS

Ansys HFSS

Descripción del empleo

imec USA’s Kissimmee, Florida R&D Center is advancing RF heterogeneous integration technologies for ultra-high-frequency applications. You will co-design and simulate CMOS and III-V devices on silicon interposers, balancing performance with manufacturability.

You will work with a multidisciplinary team across the US and Belgium, developing building blocks, performing tapeouts, and contributing to technical publications and prototypes for real-world applications.