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Acceler8 Talent is seeking an RFIC/MMIC Design Engineer to join a MIT-rooted semiconductor team pushing multi-material 3D integration. The role focuses on designing RF or MM chips with tape-out experience, contributing to a cutting-edge vertically integrated system backed by substantial funding.
The position offers a pathway to shape the future of chip design with leaders in the space. Compensation includes a base salary of up to $220,000, with equity upside as the company scales.
We are seeking an RFIC/MMIC Design Engineer to join an MIT rooted semiconductor team fundamentally shifting chip design through multi-material 3D integration.
The team are designing chips that combine materials in vertically integrated systems through advanced heterogeneous integration, and have been heavily backed through a rare $20Million+ pre-seed round. The Founders and Advisors come from the MIT ecosystem, coming from their PhD program before having significant commercial impact on semiconductor design through their careers.
You’ll join a small but heavily scaling team to own RFIC/MMIC design, and this is a genuine opportunity to shape the future of multi-material chip design with world leaders in this space.
We are looking for Engineers with demonstrable experience designing RF or MM chips, with a track record of going through tape-outs.
Compensation: up to $220,000 base salaries with considerable founding level equity upside