RFIC/MMIC Design Engineer - Tape-out Pro, Equity Eligible

Acceler8 Talent; Boston (MA); On-site; USD 180,000 - 220,000; Full time

Job summary

Acceler8 Talent is seeking an RFIC/MMIC Design Engineer to join a MIT-rooted semiconductor team pushing multi-material 3D integration. The role focuses on designing RF or MM chips with tape-out experience, contributing to a cutting-edge vertically integrated system backed by substantial funding.

The position offers a pathway to shape the future of chip design with leaders in the space. Compensation includes a base salary of up to $220,000, with equity upside as the company scales.

Qualifications

• Demonstrable RF/MMIC design experience and tape-out history.
• Experience with multi-material integration is a plus.
• Strong understanding of high-frequency circuit design principles.

Responsibilities

• Own RFIC/MMIC design from concept through tape-out.
• Collaborate with a small team to advance 3D heterogeneous integration.
• Model, simulate, and validate RF/MMIC circuits to meet performance targets.

Skills

RFIC design

MMIC design

Tape-out experience

Multi-material integration

Job description

Acceler8 Talent is seeking an RFIC/MMIC Design Engineer to join a MIT-rooted semiconductor team pushing multi-material 3D integration. The role focuses on designing RF or MM chips with tape-out experience, contributing to a cutting-edge vertically integrated system backed by substantial funding.

The position offers a pathway to shape the future of chip design with leaders in the space. Compensation includes a base salary of up to $220,000, with equity upside as the company scales.