RFIC/MMIC Design Engineer

Acceler8 Talent

Boston (MA)

Sur place

USD 150 000 - 200 000

Plein temps

Il y a 3 jours
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Résumé du poste

Acceler8 Talent is seeking an experienced Senior RFIC/MMIC Design Engineer in Boston, MA to lead end-to-end high-frequency RF solutions for radar and satellite applications.

You will own circuit architecture, design, and hardware validation, working closely with packaging and materials teams in a fast-paced startup. Significant ownership and impact on product direction are offered.

Qualifications

  • Hands-on experience designing RFIC/MMIC circuits with hardware ownership.
  • Experience with active RF circuit design (PA/LNA/beamforming).
  • Background in microwave/mmWave radar or satellite comms.
  • Ability to justify design decisions with measured data.

Responsabilités

  • Own end-to-end RFIC/MMIC circuit design from architecture to validation.
  • Design and optimize RF circuits including PAs and LNAs.
  • Develop RF solutions for radar and satellite communications.
  • Collaborate with packaging, systems, and materials teams.
  • Evaluate trade-offs among performance, power, and integration.
  • Lead RF hardware characterization, measurement, and debugging.
  • Contribute to engineering processes in a fast-moving startup.

Connaissances

RFIC/MMIC design
Power amplifiers (PA)
Low-noise amplifiers (LNA)
Beamforming circuits
High-frequency RF systems

Description du poste

An innovative semiconductor startup is seeking an experienced Senior RFIC/MMIC Design Engineer to develop next-generation high-frequency RF systems for advanced radar and satellite communications applications.

The company is developing a multi-material, 3D semiconductor platform that integrates chip, packaging, and materials technologies to deliver high-performance RF solutions.

This role offers significant technical ownership, from circuit architecture and design through hardware validation, within a small, highly technical engineering team.

Key Responsibilities
  • Own end-to-end RFIC/MMIC circuit design for high-frequency active RF systems, from architecture and implementation through validation and hardware debugging.
  • Design and optimize RF circuits, including power amplifiers (PAs), low-noise amplifiers (LNAs), and beamforming-related components.
  • Develop high-performance RF solutions for radar, satellite communications, and other demanding microwave/mmWave applications.
  • Collaborate closely with packaging, systems, and materials engineers to optimize chip-level and package-level performance.
  • Evaluate and resolve complex circuit design trade-offs involving performance, power, materials, and integration.
  • Lead RF hardware characterization, measurement, debugging, and performance optimization.
  • Contribute to the development of engineering methodologies and design processes within an early-stage semiconductor environment.
Required Qualifications
  • Strong hands-on experience designing RFIC/MMIC circuits, with demonstrated personal ownership of completed hardware designs.
  • Expertise in active RF circuit design, particularly power amplifiers, low-noise amplifiers, or beamforming-related circuits.
  • Experience working with microwave or millimeter-wave systems for radar, satellite communications, or similarly demanding applications.
  • Strong understanding of RF circuit architecture, design trade-offs, and performance optimization.
  • Hands-on experience with RF hardware validation, characterization, measurement, and debugging.
  • Ability to explain technical design decisions, measured performance, and lessons learned from completed hardware projects.
  • Comfortable working in a small, fast-moving engineering team with significant individual responsibility.
Preferred Qualifications
  • Experience developing RF circuits for radar or low Earth orbit (LEO) satellite communications.
  • Expertise in X-band, K-band, Ka-band, or adjacent microwave/mmWave frequencies.
  • Familiarity with semiconductor technologies including GaN, GaAs, SiGe, and CMOS.
  • Experience with heterogeneous integration, advanced semiconductor packaging, or chip-package co-design.
  • Background in early-stage semiconductor companies or developing new RF hardware platforms.
Why Join?
  • Significant ownership of RFIC/MMIC design from initial architecture through working silicon.
  • Opportunity to work on advanced semiconductor technologies combining RF circuits, heterogeneous materials, and 3D integration.
  • Direct collaboration with technical founders and a highly specialized engineering team.
  • Work on technically challenging radar and satellite communications applications.
  • Opportunity to influence engineering methodologies, technical direction, and product development at an early stage.
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