Product Engineering Architect: 3D IC & Heterogeneous Integration

Cadence Design Systems; San Jose (CA); On-site; USD 186,000 - 345,000; Full time

Benefits offered by this job

Bonus eligibility

Employee stock purchase plan

401(k) plan with employer match

Comprehensive medical, dental and visa

Paid vacation and holidays

Job summary

Cadence Design Systems in San Jose, California, is seeking a Product Engineering Architect to lead the technical direction of Cadence Virtuoso Heterogeneous Integration technologies and related design flows. The role partners with customers, Product Management, R&D, and Field teams to define roadmaps and deliver complex solutions.

You will shape requirements, drive validation, and mentor engineers while advancing 3D IC and advanced packaging initiatives, ensuring successful deployments and

Qualifications

• BS in Electrical Engineering, Electronics, or related technical field.
• 15+ years of relevant experience in product engineering or technical leadership.
• Deep expertise in semiconductor design, physical implementation, or EDA product engineering.
• Strong cross-functional communication and leadership abilities.
• Experience with Cadence Virtuoso platform and related design flows.

Responsibilities

• Provide senior technical leadership for 3D IC, heterogeneous integration and advanced packaging flows.
• Lead strategic customer engagements and influence product roadmap directions.
• Produce PRS, technical use cases, and support R&D during development.
• Mentor engineers and guide cross-functional teams on design challenges.
• Create technical collateral and demos to accelerate customer adoption.

Skills

Leadership

Strategic thinking

Customer engagement

Mentoring

Education

BS in Electrical Engineering

Tools

Cadence Virtuoso

APD+

Cadence SKILL

Job description

Cadence Design Systems in San Jose, California, is seeking a Product Engineering Architect to lead the technical direction of Cadence Virtuoso Heterogeneous Integration technologies and related design flows. The role partners with customers, Product Management, R&D, and Field teams to define roadmaps and deliver complex solutions.

You will shape requirements, drive validation, and mentor engineers while advancing 3D IC and advanced packaging initiatives, ensuring successful deployments and