Remote Senior PCB Layout Lead for AI Accelerators

Openkrill; United States; Remote; USD 210,000 - 230,000; Full time

Job summary

Cerebras Systems is seeking an exceptional PCB Layout Lead to own the physical implementation of complex, high‑performance boards for AI systems. You will translate schematics into production‑ready layouts, optimize signal and power integrity, thermal performance, reliability, and manufacturability.

You will own multilayer layouts from placement through fabrication release, collaborating with SI/PI, mechanical, thermal, and manufacturing teams to ensure high yield and first‑pass success on AI

Qualifications

• Bachelors or equivalent in EE.
• 10+ years in laying out complex, high-speed PCBs.
• Proficient with Cadence Allegro and Constraint Manager.
• Strong knowledge of SI/PI, EMI, thermal design, and manufacturability.

Responsibilities

• Own multilayer PCB layout from placement to fabrication release.
• Translate schematics and constraints into board designs.
• Define stackups, controlled-impedance routing, and length/phase matching.
• Place and route high-speed digital, power, and analog circuits, including BGA fanout.
• Apply SI/PI best practices to minimize crosstalk, noise, and EMI.
• Collaborate with electrical, mechanical, thermal, and manufacturing teams to resolve issues.
• Work with fabrication partners to validate stackups and via structures to improve yield.
• Perform design reviews, DFx checks, and generate release packages (Gerbers, IPC-2581).
• Maintain footprints, padstacks, libraries, and release docs.
• Support prototype builds, bring-up, failure analysis, and revisions.

Skills

PCB layout

Cadence Allegro

High-speed routing

Signal integrity

Power integrity

HDI structures

BGA escape routing

Team collaboration

Education

Bachelor’s degree in Electrical Engineering

Tools

Cadence Allegro PCB Designer

Constraint Manager

Altium Designer

Job description

Cerebras Systems is seeking an exceptional PCB Layout Lead to own the physical implementation of complex, high‑performance boards for AI systems. You will translate schematics into production‑ready layouts, optimize signal and power integrity, thermal performance, reliability, and manufacturability.

You will own multilayer layouts from placement through fabrication release, collaborating with SI/PI, mechanical, thermal, and manufacturing teams to ensure high yield and first‑pass success on AI