Remote Senior Chiplet Physical Design Engineer (SiP)

Tenstorrent Inc.; United States; Remote; USD 100,000 - 500,000; Full time

Benefits offered by this job

Highly competitive compensation package

Equal opportunity employer

Comprehensive benefits

Job summary

A cutting-edge technology company is seeking a Senior Chiplet Physical Design Engineer to design and integrate advanced chiplets into System-in-Package solutions. The ideal candidate will have 10+ years of experience in physical design and a solid background in CPU/GPU projects using tools like Synopsys and Cadence. This remote role offers competitive compensation, reflecting the candidate's skills and experience, and contributes directly to pioneering AI technology advancements.

Qualifications

• 10+ years of industry experience in physical design for CPU or GPU products.
• Proven expertise in timing closure, ECO flows, and PV convergence.
• Proficiency in scripting (TCL required; Python or similar preferred).

Responsibilities

• Design and integrate multiple chiplets into a System-in-Package (SiP).
• Own aspects of synthesis and place-and-route for high-speed CPU core designs.
• Collaborate with global teams and external partners.

Skills

Physical design engineering

Detail-oriented

Advanced nodes experience

Mentoring

Clear communication

Education

Bachelor's, Master's, or PhD in Electrical Engineering or related field

Tools

Synopsys tools

Cadence tools

Job description

A cutting-edge technology company is seeking a Senior Chiplet Physical Design Engineer to design and integrate advanced chiplets into System-in-Package solutions. The ideal candidate will have 10+ years of experience in physical design and a solid background in CPU/GPU projects using tools like Synopsys and Cadence. This remote role offers competitive compensation, reflecting the candidate's skills and experience, and contributes directly to pioneering AI technology advancements.