Physical Design Engineer

Gyga Force; San Jose (CA); Hybrid; USD 120,000 - 150,000; Full time

Benefits offered by this job

Equity

401(k) w/ 3% Match

Comprehensive medical, dental, vision, and life insurance

PTO and paid holidays

Relocation Assistance

H1B Visa Sponsorship (Transfers only)

Job summary

A semiconductor solutions firm is seeking an experienced Senior SoC/ASIC Physical Design Engineer in San Jose or Irvine, CA. The role involves leading chip implementation, refining physical design flows, and collaborating with cross-functional teams. The ideal candidate will have over 10 years of experience in ASIC/SoC design, knowledge of Synopsys tools, and strong PPA optimization skills. This full-time position offers various benefits including equity, medical insurance, and relocation assistance.

Qualifications

• At least 10 years of experience in ASIC/SoC physical design and developing PD flows.
• Strong background in RTL-to-GDSII implementation and final signoff.
• Hands‑on experience with Synopsys tools and solid understanding of their internal behavior.

Responsibilities

• Develop a modern physical design environment using current EDA tool capabilities.
• Handle block-level and top-level implementation tasks.
• Develop and maintain PD methodologies to improve efficiency.
• Collaborate with RTL, DFT, and ASIC design groups.
• Resolve timing and design challenges to ensure milestone completion.

Skills

Physical design flow development

RTL-to-GDSII implementation

Expertise in synthesis

Timing analysis

Scripting and automation

Collaboration across teams

Education

BS in Electrical Engineering

MS in Electrical Engineering

Tools

Synopsys tools

Job description

Physical Design Engineer - Location: San Jose OR Irvine, CA

Our client develops specialized semiconductor solutions for the edge, building processors capable of running AI workloads alongside bandwidth-intensive sensors and wireless platforms. Their systems are designed to interpret and analyze RF data in ways that were not previously possible.

They are seeking an experienced Senior SoC/ASIC Physical Design Engineer to take the lead on chip implementation efforts and guide the design through final closure. The role involves working closely with RTL and other cross‑functional teams while shaping and improving the physical design flow. The engineer will develop and refine methodologies aimed at achieving strong PPA results and efficient execution. This position will play a key part in meeting aggressive closure and tapeout goals with an optimized team and resource structure.

RESPONSIBILITIES

• Build and refine the PD flow: Develop a modern physical design environment using current EDA tool capabilities and ML‑driven optimizations to improve PPA, streamline resources, and accelerate closure and tapeout schedules.
• Own full-chip PD execution: Handle block-level and top-level implementation—including synthesis, floor planning, power grid creation, place and route, timing analysis, noise analysis, physical verification, EM/IR checks, and signoff tasks.
• Enhance methodology and automation: Develop and maintain PD methodologies and the supporting scripts that improve efficiency from implementation through final signoff.
• Collaborate across teams: Partner closely with RTL, DFT, and ASIC design groups to validate architectural assumptions, define timing/power/area expectations, and evaluate design tradeoffs.
• Drive closure with measurable results: Apply a data‑driven approach to identify and resolve timing, design, and flow challenges to ensure predictable milestone completion.
• Lead final signoff activities: Oversee all signoff requirements, including STA, noise analysis, LEC, physical verification, and power integrity analysis.

QUALIFICATIONS

• BS in electrical engineering or equivalent. MS is preferred but not required.
• At least 10 years of experience working in ASIC/SoC physical design and developing PD flows.
• Strong background in RTL-to-GDSII implementation and final signoff, including:
• Hands‑on experience with Synopsys tools and a solid understanding of their internal behavior.
• Expertise in synthesis, place and route, timing analysis, formal checks, CDC analysis, and power evaluation.
• Understanding of advanced CMOS and FinFET technologies, including leakage, dynamic power, and device characteristics.
• Familiarity with DFT methods—such as scan, MBIST, and LBIST—and how they impact the physical design process.
• Skilled in scripting and automation using Python, Tcl, Perl, and shell languages, as well as Makefile‑based flow.
• Comfortable analyzing extraction data, tracking quality‑of‑results metrics, and working with power‑management techniques such as DVFS, SVS, and multi‑rail SRAM approaches.
• Proven ability to collaborate effectively across teams, take ownership of closure tasks, and solve issues proactively in fast‑moving environments.

INCENTIVES & BENEFITS

• Location: San Jose or Irvine, CA
• Equity
• 401(k) w/ 3% Match
• Comprehensive medical, dental, vision, and life insurance
• PTO and paid holidays
• Relocation Assistance
• H1B Visa Sponsorship (Transfers only)

Seniority level

• Mid‑Senior level

Employment type

• Full‑time

Job function

• IT Services and IT Consulting