Quantum Packaging SI/PI Engineer - Silicon QD Systems

Intel Corporation; Hillsboro, Northern (OR, KY); Hybrid; USD 142,000 - 200,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Oregon's Hillsboro site seeks a Quantum Packaging SI/PI Engineer to model and simulate packaging hardware from redistribution layers to IC substrates in a multidisciplinary team.

You will collaborate with design and hardware teams, deliver milestones, and communicate designs; minimum qualifications include MS or PhD in EE/Physics with SI/PI experience; preferred RaptorH/X tooling experience.

Qualifications

• MS/PhD in EE or Physics with SI/PI for packaging experience.
• Experience in SI/PI modeling, simulation and optimization.

Responsibilities

• Modeling and simulation of packaging hardware including redistribution layers and IC substrates.
• Work with design and hardware teams to meet requirements.
• Perform system-level modelling and end-to-end simulations.
• Deliver milestones and communicate designs via presentations and docs.
• Stay current with packaging tech through conferences and papers.

Skills

Communication

Analytical thinking

Collaboration

Adaptability

Passion for quantum tech

Education

M.S. in Electrical Engineering or Physics

Ph.D. in Electrical Engineering or Physics

Tools

SIwave

HFSS

ADS

RaptorH/X

Job description

Intel Corporation in Oregon's Hillsboro site seeks a Quantum Packaging SI/PI Engineer to model and simulate packaging hardware from redistribution layers to IC substrates in a multidisciplinary team.

You will collaborate with design and hardware teams, deliver milestones, and communicate designs; minimum qualifications include MS or PhD in EE/Physics with SI/PI experience; preferred RaptorH/X tooling experience.