Quantum Packaging SI/PI Engineer for Silicon Quantum Dots

Intel

Hillsboro (OR)

On-site

USD 142,000 - 200,000

Full time

3 days ago

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Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel's Quantum Computing Group in Oregon (Hillsboro) seeks a Quantum Packaging SI/PI Engineer to model and simulate packaging solutions for silicon testchips and IC substrates. You will work with theory and hardware teams to meet stringent design requirements and advance scalable quantum systems.

You will perform end-to-end simulations, deliver milestones to stakeholders, and present designs. Strong communication, analytical thinking, and adaptability are essential in their fast-paced research

Qualifications

MS or PhD in Electrical Engineering or Physics with related SI/PI packaging experience.
Experience in SI/PI modeling, simulation and optimization.

Responsibilities

Modeling and simulation of packaging hardware including redistribution layers, IC substrates, and silicon testchip routing.
Work with stakeholders to meet design requirements from theory and hardware teams.
System-level modelling and end-to-end simulations to ensure designs meet requirements.
Deliver and disseminate design milestones to stakeholders.
Communicate designs in presentations and relevant documentation.
Stay current with packaging technology and techniques by reading papers and attending conferences.