Quantum Packaging Thermal Architect

Intel Corporation; Hillsboro (OR); On-site; USD 142,000 - 200,000; Full time

Benefits offered by this job

Competitive pay

Stock bonuses

Health benefits

Retirement plan

Paid vacation

Job summary

Intel Corporation in Oregon's Hillsboro campus is seeking a Quantum Packaging Modeling Engineer to drive thermal modeling and simulation for silicon packaging and quantum hardware. You will partner with packaging, mechanical design, and research teams to model heat flow and optimize designs for scalable quantum systems.

The role emphasizes cross-disciplinary collaboration, clear technical communication, and staying current with packaging advances, with an on-site work model in the United States.

Qualifications

• MS or PhD with experience in thermal modeling and simulation for packaging or related hardware.
• Experience with thermal/mechanical modeling, simulation, and optimization using Ansys Icepak, COMSOL, and related.
• Understanding of packaging technologies and thermal integration.

Responsibilities

• Thermal modeling and simulation of packaging hardware to understand heat flow from silicon test chips through various heat spreader hardware
• Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders
• Work closely with mechanical designers to define heat spreaders for optimal performance
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

Skills

Communication skills

Analytical thinking

Collaboration

Adaptability

Quantum tech passion

Education

MS in Electrical Engineering or Physics

PhD in Electrical Engineering or Physics

Tools

Ansys Icepak

COMSOL

Job description

Job Details: Job Description

Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing.

Key Responsibilities

• Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware
• Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders
• Work closely with mechanical designers to define heat spreaders for optimal performance
• Deliver and disseminate design milestones to stakeholders
• Communicate designs in presentations and relevant documentation
• Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers

Qualifications

As a successful candidate, you must possess:

• Excellent communication and presentation skills for technical and non-technical audiences
• Strong analytical thinking and problem-solving capabilities
• Collaborative mindset with ability to work effectively across diverse teams
• Adaptability to work in a fast-paced, innovative research environment
• Passion for pushing the boundaries of quantum technology development

Minimum Qualifications

• M.S. degree in Electrical Engineering, Physics or related field AND 5+ years of experience in in Thermal modeling and simulation for packaging, or other related hardware.
• OR Ph.D. degree in Electrical Engineering, Physics or related field with academic or work experience in the related areas.
• Experience with thermal/mechanical modeling, simulation, and optimization with simulation software such as Ansys Icepak, COMSOL, and related.
• Understanding of packaging technologies and thermal integration.

Preferred Qualifications

• 2+ years of experience with thermal/mechanical cryogenic packaging modeling and simulation.

Job Type

Experienced Hire

Shift

Shift 1 (United States of America)

Primary Location

US, Oregon, Hillsboro

Additional Locations

Additional Locations: Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US

$141,910.00-200,340.00 USD

Work Model for this Role

This role will require an on-site presence.

Job posting details (such as work model, location or time type) are subject to change.

* ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter. Intel’s official careers website.