Quantum Packaging Engineer - Die & Bonding

Amazon Inc.

Omaha, Northern (NE, KY)

Hybrid

USD 75,000 - 131,000

Full time

7 days ago

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Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a Hardware Development Engineer with semiconductor process development experience in dicing, probing, wirebonding, and flip chip bonding to advance quantum computing hardware.

You will work in a cleanroom and in packaging to fabricate and test quantum processor chips, solving fabrication challenges and driving yield improvements. The role emphasizes hands-on packaging tasks, equipment operation, and collaboration across teams to

Qualifications

2+ years of technical support experience.
2 years of direct microfabrication experience.
2 years hands-on wafer level and die level handling, die cleaning, and optical inspection equipment.
Excellent communication and writing skills.

Responsibilities

Lead the sustainment and development of die singulation, die preparation, and device probing.
Support wirebonding and flip chip bonding as needed.
Operate and maintain equipment to ensure optimal process outcomes and troubleshoot issues.
Design, build, and maintain backend process infrastructure to improve efficiency and workflows.
Analyze process data to identify trends and drive yield improvements.