Quantum Packaging Engineer — Optoelectronic & PICs

Radiant Dev LLC.; Albuquerque (NM); On-site; USD 110,000 - 180,000; Full time

Job summary

Radiant Dev LLC in Albuquerque leads the regional Quantum Technology Hub, driving the transition of quantum breakthroughs into scalable hardware. You will head end-to-end packaging development for optoelectronic and microelectronic packaging of quantum hardware and PICs.

The role emphasizes DOE-driven process development, yield optimization, metrology, and cross-functional collaboration with national labs and vendors to deploy robust packaging solutions.

Qualifications

• MS/PhD in Physics, Materials Science, Optical, Electrical, Mechanical Engineering, Chemistry, or related field.
• 3–7+ years hands-on experience in electronic packaging, photonics, microelectronics assembly, or reflow solder systems.
• Experience in Quantum, Photonics, Semiconductor, MEMS, or Advanced PCB environments.

Responsibilities

• Design and execute experimental matrices for packaging processes.
• Perform DOE, FMEA, and root-cause analysis to improve yields and reliability.
• Conduct metrology and testing on prototype micro-devices (optical/electrical/RF).
• Diagnose packaging issues using characterization tools (SEM, EDX, XRD, XPS).
• Author SOPs, release recipes to production, and train technicians.
• Collaborate with national labs, vendors, and client teams on packaging solutions.

Skills

Data analytics

Statistical analysis

Python

Education

M.S./Ph.D. in Physics / Materials Science / Optical / Electrical / Mechanical Engineering

Tools

JMP

Minitab

Python

Excel

Job description

Radiant Dev LLC in Albuquerque leads the regional Quantum Technology Hub, driving the transition of quantum breakthroughs into scalable hardware. You will head end-to-end packaging development for optoelectronic and microelectronic packaging of quantum hardware and PICs.

The role emphasizes DOE-driven process development, yield optimization, metrology, and cross-functional collaboration with national labs and vendors to deploy robust packaging solutions.