Packing Engineer

Radiant Dev; Albuquerque (NM); On-site; USD 110,000 - 180,000; Full time

Job summary

Radiant Dev LLC in Albuquerque leads the regional Quantum Technology Hub, driving the transition of quantum breakthroughs into scalable hardware. You will head end-to-end packaging development for optoelectronic and microelectronic packaging of quantum hardware and PICs.

The role emphasizes DOE-driven process development, yield optimization, metrology, and cross-functional collaboration with national labs and vendors to deploy robust packaging solutions.

Qualifications

• MS/PhD in Physics, Materials Science, Optical, Electrical, Mechanical Engineering, Chemistry, or related field.
• 3–7+ years hands-on experience in electronic packaging, photonics, microelectronics assembly, or reflow solder systems.
• Experience in Quantum, Photonics, Semiconductor, MEMS, or Advanced PCB environments.

Responsibilities

• Design and execute experimental matrices for packaging processes.
• Perform DOE, FMEA, and root-cause analysis to improve yields and reliability.
• Conduct metrology and testing on prototype micro-devices (optical/electrical/RF).
• Diagnose packaging issues using characterization tools (SEM, EDX, XRD, XPS).
• Author SOPs, release recipes to production, and train technicians.
• Collaborate with national labs, vendors, and client teams on packaging solutions.

Skills

Data analytics

Statistical analysis

Python

Education

M.S./Ph.D. in Physics / Materials Science / Optical / Electrical / Mechanical Engineering

Tools

JMP

Minitab

Python

Excel

Job description

• Base Salary: $110,000 – $180,000 / year (DOE)
• Reports To: Director of Packaging

Role Summary

Join a designated regional Quantum Technology Hub driving the transition of quantum breakthroughs into scalable, commercial hardware. Working in an advanced packaging and commercialization facility, you will lead the end-to-end development, qualification, and deployment of optoelectronic and microelectronic packaging processes for quantum hardware and photonic integrated circuits (PICs).

Key Responsibilities

• Process Development: Design and execute experimental matrices for flip chip bonding, Au/Al wire bonding, reflow soldering, and optical coupling (active/passive fiber-to-chip attach).
• Optimization & Yield Improvement: Conduct Design of Experiments (DOE), FMEA, and root-cause failure analysis to improve assembly yields and reliability.
• Metrology & Testing: Perform mechanical pull/shear testing, environmental reliability testing, and optical/electrical/RF characterization on prototype micro-devices.
• Failure Analysis: Diagnose packaging issues using thin-film and material characterization tools (SEM, EDX, XRD, XPS, optical profilometry).
• Manufacturing Scale-Up: Author SOPs, release qualified packaging recipes to production, and train technician personnel.
• Cross-Functional Collaboration: Partner with national labs, external hardware/equipment vendors, and client teams to deliver custom packaging solutions.

Qualifications

Required

• Education: M.S. or Ph.D. in Physics, Materials Science, Optical, Electrical, or Mechanical Engineering, Chemistry, or a related discipline.
• Experience: 3–7+ years of hands-on experience in electronic packaging, photonic systems, microelectronic assembly, or reflow solder systems.
• Industry Background: High-tech experience in Quantum, Photonics, Semiconductor, MEMS, or Advanced PCB environments.
• Technical Breadth:
• Solid grasp of optical waveguide physics, thermal expansion matching, and fiber alignment.
• Hands-on operation of flip chip bonders, wedge/ball wire bonders, reflow ovens, and optical profilers.
• Laboratory cleanroom experience conducting electrical, RF, and optical characterization.
• Data Analytics: Proficiency in statistical data analysis using JMP, Minitab, Python, or advanced Excel.

Preferred

• Proven experience transferring assembly processes from R&D into sustained manufacturing lines (tech transfer).
• Direct exposure to quantum hardware sub-assemblies, cryogenic packaging, superconducting circuits, or ion-trap vacuum enclosures.
• Familiarity with Class 100/1000 (ISO 5/6) cleanroom protocols, ESD control, and chemical handling.
• Formal Lean Six Sigma (Green/Black Belt) or SPC certifications.