Quantum Packaging & Die Prep Engineer

Amazon; Pasadena (CA); On-site; USD 75,000 - 131,000; Full time

Benefits offered by this job

Health insurance

Job summary

Amazon AWS Center for Quantum Computing in Pasadena, CA is hiring a Hardware Development Engineer to advance semiconductor processes for quantum computing devices. The role focuses on die singulation, device probing, and packaging tasks in a cleanroom environment, with emphasis on reliability and yield improvement.

Training is day-time, followed by independent evening work. Responsibilities include maintaining backend process infrastructure, data-driven optimization, and cross-functional

Qualifications

• 2+ years of technical support experience
• 2 years of direct microfabrication experience
• 2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment
• Excellent communication and writing skills

Responsibilities

• Lead the sustainment and development of die singulation, die preparation, and device probing
• May need to support wirebonding, and flip chip bonding
• Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals
• Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations
• Analyze process data to identify trends, improve stability, and drive continuous yield improvement

Skills

Technical support

Microfabrication

Wafer handling

Optical inspection

Communication

Tools

MES system

Data analysis tools

Job description

Amazon AWS Center for Quantum Computing in Pasadena, CA is hiring a Hardware Development Engineer to advance semiconductor processes for quantum computing devices. The role focuses on die singulation, device probing, and packaging tasks in a cleanroom environment, with emphasis on reliability and yield improvement.

Training is day-time, followed by independent evening work. Responsibilities include maintaining backend process infrastructure, data-driven optimization, and cross-functional