Quantum Fabrication Technician – Die Prep and Probing

Amazon Web Services (AWS)

Pasadena (CA)

On-site

USD 75,000 - 131,000

Full time

7 days ago

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Job summary

Amazon Development Center U.S., Inc. in Pasadena, CA is seeking a Hardware Development Engineer with semiconductor process development expertise in dicing, electrical probing, wirebonding and flip chip bonding to advance AWS cloud quantum computing efforts.

You will contribute in the device fabrication group, solving fabrication and characterization challenges for novel quantum processors, both in cleanroom and non-cleanroom environments, with a schedule that spans late afternoon to overnight

Qualifications

2+ years of technical support experience.
2 years of direct microfabrication experience.
2 years experience with hands-on wafer level and die level handling, die cleaning, and optical inspection equipment.
Excellent communication and writing skills.

Responsibilities

Lead the sustainment and development of die singulation, die preparation, and device probing.
May need to support wirebonding, and flip chip bonding.
Operate and maintain associated equipment to ensure optimal process outcomes and provide rapid, expert troubleshooting of process and equipment issues to minimize downtime and maintain production goals.
Design, build, and maintain backend process infrastructure to enhance efficiency, organization, and scalability. Implement standardized work practices and optimize workflows for streamlined operations.
Analyze process data to identify trends, improve stability, and drive continuous yield improvement.