CMP Process Engineer - Semiconductor Packaging (Onsite)

QUANTUM COMPUTING, INC.

Odon (IN)

On-site

USD 90,000 - 130,000

Full time

3 days ago
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Job summary

Quantum Computing Inc. is seeking an experienced CMP Engineer to develop and optimize Chemical Mechanical Planarization processes in a high-volume semiconductor packaging environment.

You will run DOEs, qualify equipment, and work with cross-functional teams to improve yields and reduce defects. The role requires hands-on CMP experience, strong analytical skills, and collaboration with Process Integration, Equipment Engineering, and Metrology.

Qualifications

  • Bachelor's degree in Engineering or related technical discipline.
  • 3+ years CMP experience in semiconductor manufacturing.
  • Strong understanding of semiconductor materials and fabrication.
  • Experience developing and executing DOE.
  • Experience with SPC and data-driven optimization.
  • Experience qualifying process equipment and implementing improvements.
  • Strong analytical, troubleshooting, and collaboration skills.

Responsibilities

  • Develop, optimize, and sustain CMP processes.
  • Design and execute DOE to improve capability, yield, and performance.
  • Qualify new equipment, materials, and process changes.
  • Monitor process performance and reduce defects and variability.
  • Utilize SPC methodologies to maintain process health.
  • Analyze process data and prepare technical reports and recommendations.
  • Partner with Process Integration, Equipment Engineering, and Metrology teams.
  • Drive continuous improvement for throughput, yield, and reliability.
  • Maintain ownership of CMP equipment and support long-term roadmaps.

Skills

DOE
SPC
Data analysis
Analytical thinking
Collaboration
Technical communication

Education

Bachelor's degree in Engineering, Materials Science, Chemistry, Physics, or related

Tools

Statistical tools

Job description

Quantum Computing Inc. is seeking an experienced CMP Engineer to develop and optimize Chemical Mechanical Planarization processes in a high-volume semiconductor packaging environment.

You will run DOEs, qualify equipment, and work with cross-functional teams to improve yields and reduce defects. The role requires hands-on CMP experience, strong analytical skills, and collaboration with Process Integration, Equipment Engineering, and Metrology.

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