Cryogenic Quantum Materials Engineer - Advanced Packaging

GLOBALFOUNDRIES U.S. INC.; Town of Malta (NY); On-site; USD 143,000 - 247,000; Full time

Job summary

GlobalFoundries Fab8 is seeking an experienced R&D cryogenic/superconducting materials engineer to advance quantum packaging from concept to manufacturing. You will own development, selection, and integration of materials for high-performance, scalable quantum systems.

Responsibilities include leading materials schemes for cryogenic environments, evaluating conductivity, thermal properties, and mechanical robustness while driving 2D/2.5D/3D packaging architectures and interconnect stacks.

Qualifications

• Master’s degree in a relevant field is required.
• 15+ years of related work experience is required.
• English language fluency (written and verbal) is required.
• Up to 20% travel may be required.

Responsibilities

• Lead selection and development of materials systems for cryogenic and superconducting packaging.
• Define material stacks and interfaces across BEOL/RDL, interposers, TSVs, and bonding interfaces.
• Drive deposition, plating, bonding, and surface preparation process development.
• Collaborate with material suppliers, OSATs, and partner teams to enable scalable integration.
• Evaluate material properties including electrical conductivity, thermal transport, and mechanical robustness.
• Ensure materials compatibility with manufacturing flows and downstream assembly.

Skills

Cryogenic materials engineering

Superconducting materials

Packaging integration

Cross-functional collaboration

Process development

Education

Master’s degree in Electrical/Mechanical/Chemical Engineering or Materials Science

Job description

GlobalFoundries Fab8 is seeking an experienced R&D cryogenic/superconducting materials engineer to advance quantum packaging from concept to manufacturing. You will own development, selection, and integration of materials for high-performance, scalable quantum systems.

Responsibilities include leading materials schemes for cryogenic environments, evaluating conductivity, thermal properties, and mechanical robustness while driving 2D/2.5D/3D packaging architectures and interconnect stacks.