Quantum Hardware Interconnect Lead: Cryogenic Tech

Google LLC; Santa Barbara (CA); On-site; USD 188,000 - 274,000; Full time

Job summary

Google LLC in Santa Barbara, CA seeks a Share Advanced Interconnect Lead, Quantum AI to lead the interconnect team and drive integration for cryogenic microwave devices and superconducting quantum processors.

You will collaborate with researchers and engineers on the Quantum AI team, as well as external partners, to advance integration technologies and meet roadmap milestones. Strong leadership and cross-disciplinary skills are essential.

Qualifications

• Bachelor’s degree or equivalent practical experience in Electrical/Computer Engineering, Physics or related fields.
• 6 years of R&D experience in MEMS, PCB, or silicon technologies.
• 3 years of technical leadership experience.

Responsibilities

• Lead and manage our growing advanced interconnect technology team.
• Develop advanced integration and interconnect technologies for cryogenic microwave devices and superconducting quantum components.
• Scope and purchase tools needed for development of integration technologies, including materials and processes.
• Collaborate with industrial and academic partners as project technical lead for external technology development and implementation.
• Write documentation and transfer developed processes/technologies to production.

Skills

Leadership

Collaboration

Programming/scripting

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, or a specialized field

Master's degree or PhD in Electrical Engineering, Computer Engineering, Physics, or related field

Tools

Scripting language

Job description

Google LLC in Santa Barbara, CA seeks a Share Advanced Interconnect Lead, Quantum AI to lead the interconnect team and drive integration for cryogenic microwave devices and superconducting quantum processors.

You will collaborate with researchers and engineers on the Quantum AI team, as well as external partners, to advance integration technologies and meet roadmap milestones. Strong leadership and cross-disciplinary skills are essential.