Quantum Advanced Packaging Lead

GLOBALFOUNDRIES U.S. 2 LLC; Essex Junction (VT); On-site; USD 118,000 - 210,000; Full time

Job summary

GlobalFoundries is seeking a seasoned manager to drive the Quantum advanced packaging efforts in Fab9, Burlington, Vermont. You will lead the Quantum Advanced Packaging team to develop cryogenic and superconducting capabilities, including wafer-to-wafer and die-to-wafer bonding, interposers, and related technologies.

Responsibilities include hiring, guiding program planning and execution, and collaborating with vendors and internal teams to meet project goals.

Qualifications

• Master's degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science, or related field.
• 10+ years of related work experience.
• 2+ years of technical lead/management experience.
• Willingness to travel up to 10%.
• Fluency in English (written & verbal).

Responsibilities

• Lead and develop the Quantum Advanced Packaging team, providing clear direction, coaching, and performance management.
• Manage hiring, onboarding, and capability building to support team growth.
• Oversee project execution, ensuring delivery on timelines, quality, and technical objectives.
• Drive program planning, including timelines, reviews, and stakeholder updates.
• Resolve conflicts and address employee concerns.
• Define and scope development programs aligned to internal and external customer needs.
• Manage budgets and resource allocation for prototype and development activities.
• Establish and maintain strategic partnerships with vendors and development collaborators.
• Execute the advanced packaging roadmap.
• Ensure effective collaboration across cross-functional teams to meet program goals.
• Report on team performance and progress to senior management.

Skills

English fluency

Team leadership

Education

Master's degree (EE / ME / Chem Eng / Materials Sci)

PhD (preferred)

Job description

GlobalFoundries is seeking a seasoned manager to drive the Quantum advanced packaging efforts in Fab9, Burlington, Vermont. You will lead the Quantum Advanced Packaging team to develop cryogenic and superconducting capabilities, including wafer-to-wafer and die-to-wafer bonding, interposers, and related technologies.

Responsibilities include hiring, guiding program planning and execution, and collaborating with vendors and internal teams to meet project goals.