Quantum TSV Packaging Engineer

GlobalFoundries; Town of Malta (NY); On-site; USD 98,000 - 176,000; Full time

Job summary

GlobalFoundries in the Town of Malta is seeking a Quantum TSV Integration Engineer to lead the development of cryogenic, superconducting TSV technologies for scalable quantum packaging. The engineer will collaborate with various teams to ensure process integration from concept through manufacturing.

The role requires a Master's degree in a relevant field and extensive experience, with a strong emphasis on optimizing TSV designs and managing projects effectively.

Qualifications

• Master's degree required, with 8+ years of related work experience.
• Education preferred at PhD level with 5+ years of experience.
• GPA of 3.0 or higher required.

Responsibilities

• Lead development of cryogenic TSV processes.
• Ensure TSV designs are optimized for signal transport.
• Collaborate with teams to transition R&D to manufacturing.

Skills

Project management

Strong written and verbal communication

Cryogenic and superconducting applications knowledge

Education

Master’s in Electrical Engineering or related field

Tools

Deep silicon etch (DRIE)

Conformal deposition techniques

Job description

GlobalFoundries in the Town of Malta is seeking a Quantum TSV Integration Engineer to lead the development of cryogenic, superconducting TSV technologies for scalable quantum packaging. The engineer will collaborate with various teams to ensure process integration from concept through manufacturing.

The role requires a Master's degree in a relevant field and extensive experience, with a strong emphasis on optimizing TSV designs and managing projects effectively.